T2-2024 NAND Storage Analyst Video Briefing and Highlights
Discover KIOXIA/WD's BiCS8 218L 3D NAND with CBA technology. This update covers 3D NAND scaling, QLC advancements, and future SSD performance trends, as discussed at the T2-2024 NAND Storage Analyst Briefing.
With 3D NAND Flash memory and storage technology innovation, SSDs now perform faster and better while consuming less power and costing less. 3D NAND is now pursuing more QLC and more layers such as 2xx, 2yy, and 3xx. For further 3D NAND scaling for higher performance and higher density, dimensional scaling is required, but logical and energy/power scaling are also needed. With increasing layers and stacks, the peripheral scaling corresponding to higher array density has been developed such as the direct bonded (or hybrid bonded) CMOS wafer structure. As such, KIOXIA/WD recently revealed its BiCS8 218L 3D NAND with CBA (CMOS directly bonded array) technology. We review and discuss the details of the 3D NAND technology roadmap, trends, comparisons, and outlooks at the T2-2024 NAND Storage Analyst Video Briefing.
