Baidu Kunlun II SoC Digital Floorplan Analysis
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This report presents a Digital Floorplan Analysis of the 2RS9A die found inside Baidu KUNLUN-A2S1CAXGA component extracted from the Baidu Kunlun R200 artificial intelligence (AI) accelerator chip. The analysis includes structural analysis, critical dimensions, and layout analysis of digital blocks, along with die utilization calculations, including the total area for logic, I/O, memory, and analog components separately. This provides information and insights into the design and process attributes that may relate to performance. Additionally, foundry and process node identification, as well as cost analysis, are provided.
The Kunlun Core AI accelerator card R200 series, powered by the Kunlun Core 2nd generation AI chip, is tailored for high-performance inference applications within data centers. It provides comprehensive support for a wide range of artificial intelligence tasks, including natural language processing, computer vision, speech recognition, and traditional machine learning.
The information contained in this report is relevant to:
- Chip Fabrication/Foundries: Analyze the digital blocks layout and Identify process features used on the target device. This involves examining the structural aspects, critical dimensions, and layout of the digital blocks to understand the design and manufacturing techniques employed.
- Fabless/Chip Designer: Understand how competitors design their products and explore the know-how behind their design. This includes studying the design methodologies, architectural choices, and technological innovations used by competitors to gain insights and enhance one's own design processes.
