VLSI Technology Symposium – Intel describes i3 process, how does it
measure up?

Intel released details of their i3 process technology. The The i3 process will offer multiple variants targeted at different applications:

1. i3 base process and i3-T with TSVs targeting client, server and base die for chiplet applications,
2. i3-E with native 1.2 volt I/O devices, deep N-wells, and long channel analog devices, targeting chipsets and storage applications and
3. i3-PT for high performance computing and AI with 9μm pitch TSVs and hybrid bonding. This report compares the i3 to Samsung and TSMC technology, providing insight into how it measures up.

Read the full report