Apple R1 SoC Advanced
Packaging Analysis
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This report provides deeper insight on the advanced packaging innovations used in the manufacturing of the Apple R1. The analysis includes structural and materials analysis, and critical dimensions, providing information on form factor as well as insights into the architecture attributes that may relate to performance or thermal management.
The Apple Vision Pro is a new kind of device fusing augmented reality and virtual reality display capabilities with significant on-board compute power. That goal requires real-time computation capabilities to align and display the data from the cameras and sensors with the perceptions of the user. Apple has developed and deployed a new processor, the R1 chipset, to tackle the real-time computing challenges of the Vision Pro. The R1 is not the main application processor of the Vision Pro, but instead is dedicated to supplementary low-latency processing. However, without the low-latency performance of the R1, the Vision Pro would not function as envisioned.
The memory wall problem and associated latency issues pose unique challenges for real-time processing, and Apple has had to address those issues in the R1. The package reduces latency by integrating SK hynix DRAM and the TSMC produced R1 system-on-chip (SoC) into a novel wafer-level package architecture.
