The Hi-5021Q is a 50 MP, 0.70 µm stacked back illuminated CMOS image sensor. It is the first SK hynix image sensor analyzed by TechInsights to use hybrid bond to connect the CIS and ISP dies. This is also the first commercially available image sensor to use an air gap grid.
Chips, China, and Consequences: Navigating the Impact of Trump's Technology Tariffs
Explore how U.S. technology tariffs are reshaping global chip markets in Chips, China, and Consequences, an exclusive TechInsights eBook. Available only on the TechInsights Platform.
Maximize Wafer Efficiency with TechInsights’ Die Calculator
The Die Calculator from TechInsights empowers engineers, procurement specialists, and finance teams with the insights they need to understand die utilization and yield with confidence.
Earth Day 2025: A Progress Report on Sustainable Semiconductor Manufacturing
Can the chip industry scale innovation and sustainability? Discover the current state of green tech in one of the world’s most energy-intensive sectors.
