The SRMZ1 is a 3D packaging assembly comprising a side-by-side arrangement of four dies, including system-on-chip (SoC) die with die makings 8PNRC, mounted on a common interposer placed on the package wiring board (PWB) employing Intel’s 3D Performance Hybrid Architecture packaging technology. SRMZ1 application processor was extracted from the Acer 14" Swift Go 14 multi-touch laptop.
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