HiSilicon Kirin 9000 and Kirin 9006C Processors – A Comparative Look at Taiwanese and Chinese PoP Packaging Technology Advanced Packaging Quick Look Analysis
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This is an Advanced Packaging Quick Look (APQ) summary document comparing the Kirin 9000 and the Kirin 9006C processors, provided as a companion deliverable for APQ-2312-802 projects. In 2020, the US government enacted sanctions on Huawei and HiSilicon, constraining their access to manufacturers and markets outside of China. In the current report, the package structure of the Kirin 9000, released in 2020 before the US sanctions were imposed, and the Kirin 9006C, released in 2023 after the sanctions were imposed, are compared to provide a look into what effect the US sanctions have had on packaging technology. The Kirin processors were selected for this packaging analysis because TechInsights has previously found both devices use package-on-package (PoP) packaging technology, and both devices use the same TSMC 5 nm processor die.
