CXMT CXDBCCCDM-MA LPDDR4X DRAM Memory Floorplan Analysis
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The CXDBCCCDM-MA was extracted from the Xiaomi REDMI 12 5G smartphone. This report presents a Memory Floorplan Analysis (MFR) of the CXMT CXDBCCCDM-MA die found inside CXMT CXDBCCCDM-MA package. The Xiaomi REDMI 12 is an 5G smartphone built around the Qualcomm Snapdragon 4 Gen 2 SoC. It features 128GB internal storage and 4GB of RAM. The CXMT CXDBCCCDM-MA is a BGA package measuring 14.99 mm × 10.01 mm × 0.68 mm thick, with 200 solder balls at the bottom. The CXDBCCCDM-MA package contains eight 6 Gb LPDDR4X DRAM dies. The DRAM feature size designates the device as CXMT G3 class DRAM.
