TechInsights for Fabless Semiconductor

Full Hardware/System Shipment Metrics (Units & Revenues)

• OEM & Aftermarket Systems/ECUs
• Entry/Mid/Premium-Headunits, ECUs, etc.

Detailed Feature forecasts by System & Region

• By key vehicle segment, e.g. Premium, Midrange, Entry level vehicle: Audio, HMI, Media & Storage, Navigation, Telematics, Wired and Wireless Connectivity, Databus

OEM-level forecasting for key areas

• Embedded Telematics Shipments: By OEM and Region
• Embedded Navigation Shipments: By OEM and Region
• Smartphone Projection Shipments: By OEM
• Centre Multifunction Display Shipments: By OEM and Size

Detailed Semiconductor Forecasts

• Application Specific Semis (ASIC/ASSP/CPLD) & MCU
• Units and Revenues, ASPs & Regional Demand

Detailed Semiconductor Forecasts

• Application Specific Semis (ASIC/ASSP/CPLD) & MCU
• Units and Revenues, ASPs & Regional Demand

Market Share Analysis

• Tier 1 Suppliers
• Semi Suppliers
• Operating Systems

System Demand (Jan, Apr/May, Jul, Oct)

• Updated quarterly in Excel & PPT format; Annual written analysis in PDF
• Contains detailed forecasts for over 100 systems

Semiconductor Demand (Jan, Apr/May, Jul, Oct)

• Updated quarterly in Excel with associated executive summary in PDF; Annual written analysis in PDF
• Details the semiconductor demand for 27 different automotive semiconductor types

Global xEV Semiconductor Demand Forecast

• Updated quarterly in Excel
• Quarterly view of the global outlook for xEV systems and associated semiconductor and sensor demand

Sensor Demand (Jan, Apr/May, Jul, Oct)

• Updated quarterly in Excel & PPT format; Annual written analysis in PDF
• Details the semiconductor demand for 71 different automotive sensor types

ADAS Systems & Sensors (Feb, May, Aug, Nov)

• Updated quarterly in Excel & PPT format
• Summary of ADAS data contained in AVS

Global Ride Hailing

• Updated annually in Excel format; written analysis in PDF.
• Key metrics on services in over 110 countries include active driver totals, active user totals, average trip pricing, revenues, and driver and company share of revenue.

Car Sharing

• Updated annually in Excel format; written analysis in PDF.
• Provides estimates and projections for worldwide B2C car sharing operator fleet sizes, membership totals, and revenue by service type and per car.

System Demand (Jan, Apr/May, Jul, Oct)*

• Regional and global coverage
• Updated quarterly in Excel format; Annual written analysis in PDF
• Contains detailed forecasts for the key xEV systems including battery management systems, main inverters etc.

Semiconductor Demand (Jan, Apr/May, Jul, Oct)*

• Updated quarterly in Excel; Annual written analysis in PDF
• Outlines the semiconductor demand from key xEV systems, detailing demand across power, processor, linear and other device types.

Sensor Demand (Jan, Apr/May, Jul, Oct)*

• Updated quarterly in Excel; Annual written analysis in PDF
• Details the sensor demand from key xEV systems incorporating current, temperature and position/speed sensors

Battery Demand Forecast (Annual)

• Lithium battery demand forecast by powertrain type and market region delivered annual in Excel format
• Complements annual report looking at battery technology developments

Charging Infrastructure Outlook (Annual)

• Charging infrastructure outlook detailing installed base and future activities related to key supplier, mandates and legislation that will facilitate the rollout of infrastructure across major regions.

* Presented in same deliverable

ADAS Systems & Sensors (Feb, May, Aug, Nov)

• Updated quarterly in Excel & PPT format
• Annual written analysis in PDF
• Contains detailed forecasts for both systems (e.g. LDWS) and sensors (e.g. mono front camera)

ADAS Semi Demand (Feb, May, Aug, Nov)

• Updated quarterly in Excel format
• Contains detailed forecasts for a wide range of semiconductor devices, linked back to the system and region that’s driving demand

Autonomous Vehicle Market Scenarios (Nov)

• Updated annually in Excel & PPT format
• Detailed scenarios to 2050 for vehicle and sensor volumes by level (L0 to L5)

Provide curated data with technical insight on ADAS, Cameras, LiDAR, Radar, Audio Amplifiers, and Infotainment systems to reveal design wins and provide valuable context how individual components contribute to the larger picture.

Processor Market Analysis

Focus on processors and SoCs for various applications, including servers, PCs, supercomputers, smartphones, wearables, embedded systems, IoT devices, and automotive applications. Additionally, we cover licensable and open-source cores for CPU, DSP, graphics, and more, with recent articles emphasizing AI accelerators in cloud, edge, automotive, mobile, and IoT contexts.

Process Analysis

Understand all aspects of advanced logic technologies, gain visibility into the competition’s historical – and anticipated – approach, and make better next-node technology choices.

Packaging Analysis

Comprehend every facet of advanced logic technologies, assess the historical and anticipated strategies of competitors, and make informed decisions for the next technology node.

Performance Analysis

See the complete picture of process technology and DC performance. Understand the process, see the performance, spot the trends.

Transistor Comparison

10 reports, ~5 reports refreshed annually, studying the last 3 technology generations by company and across companies: TSMC, Samsung, Intel.

IC Floorplan

A high-level view of SoC design quality, focusing on leading-edge APU, CPU, GPU, AI accelerator, FPGA, baseband / connectivity, VPU, advanced MCU components, plus emerging applications such as AR and vision processing SoCs.

Circuit Analysis

Focused on high volume first-to-market SoCs on leading fabless / foundry combinations, this subscription provides standard cell analysis and layout analysis on multiple areas of leading-edge SoCs.

IC Floorplan

Provides insight into competitive designs including high-level block identification, high-level process data, and manufacturing costs for leading-edge transceivers in smart home products, wearables, and routers across market leaders and disruptors over major wireless standards such as Bluetooth, Wi-Fi, NFC, UWB, and more.

Circuit

Enables a better comparison and understanding of how design constraints and challenges are addressed for leading-edge transceivers in smart home products, wearables, and routers across market leaders and disruptors over major wireless standards such as Bluetooth, Wi-Fi, NFC, UWB, and more.

IoT Modules

With increasing focus on edge computing, industrial IoT, and AI, IoT modules are a key component in enabling the intercommunication of devices through the internet. This channel uncovers technical innovation in IoT Modules in cutting edge consumer electronics to reveal key competitive insight on market leaders. Sample manufacturers include Gemalto, Google, Arduino, Nvidia.

Process

Provides in-depth process analysis for GaN, SiC, and Si power devices, providing comprehensive coverage of device metrics and salient features.

Process Flow

Provides in-depth process flow analysis detailing the manufacturing steps to fabricate innovative SiC power devices from wafer-in to wafer-out.

Process

Content includes structural, materials, and topographical analyses of acoustic filters from highly integrated 5G RF Front End Modules and System-in-Packages (SiPs) as well as transceivers and front end modules from the latest 5G handsets.

Block Diagram

Provides the most detailed RF front end block diagrams (from the antennae to the RF transceiver) for flagship 5G handsets in the industry for an in-depth understanding of RF front end design.

Circuit

Re-creation of hierarchical schematics that mirror a developer’s design from the block down to the gate level.

IC Floorplan

Highlights key functional blocks of the transceiver to better understand the chip in the context of the technology innovation landscape.

Packaging

Enables the comparison of various RFIC advanced packaging implementations to gain a better understanding of how they impact RF system design.

Circuit

Leverage the advantage of insights into the detailed differentiated designs in use by leading fabricators. This content provides proprietary analysis of image sensor circuit functionality, structure, and layout through a highly interactive, easy-to-navigate view into circuit design.

Process

Access a wide range of device information from a single, reliable source which provides you a broad overview of imaging and optical sensing devices each year for ongoing monitoring of state-of-the-art mainstream and emerging/high-growth applications.

Process Flow

Access hard-to-find details on process steps and toolsets in imaging and sensing equipment fabrications. This content provides insight into the process steps required to fabricate a variety of imaging/optical sensing ICs and a deep understanding of the real development costs.

Packaging

Provides insights to structural and assembly strategy for packaging and related integration innovations.

IC Floorplan

Gain insights to the functional blocks and die utilization of stacked and standalone image signal processors. This content provides floorplan (functional) analysis of image signal processors (ISP) in applications such as smartphone, automotive imaging and optical sensing, computer/machine vision, edge AI, IoT, LiDAR, security/ surveillance, and more.

Circuit

Highlights circuit innovation by providing full, transistor-level analysis on leading-edge memory circuits as well as circuit schematic design of critical device metrics for a better understanding of peripheral design, functionality, structure, and layout.

IC Floorplan

Identifies the functional blocks, their purpose, their technology generation, and their relative cost to produce. It explores the placement of different functional blocks and resulting changes in performance.

Transistor Characterization

Provides cross-technology and trend analysis as well as information on the performance of transistors through transistor characteristic analysis.

Process

Provides an overview of chip technology, critical features, and dimensions. It provides analyst insights into technical trends and roadmaps, design technology interaction analyses, detailed explanations of process integrations, and next node predictions.

Process Flow

Provides and tabulates a listing of process steps for a better understanding of how a chip is manufactured to help identify areas for process optimization.

SSDs

Our SSDs channel represents a sampling of industry leaders in the SSD space. Uncover the driving forces behind density increases and cost reductions. Sample manufacturers include Samsung, Micron, Intel, SK hynix, SanDisk, Toshiba.

Emerging Device Technologies

TechInsights’ Emerging Device Technologies (EDT) subscription delivers fast-moving shipment tracking and sales forecasting of the key technologies powering modern smartphones and emerging classes of new devices. EDT identifies the key technologies powering smartphones right now and which will emerge in the future, such as artificial intelligence or 5G mmWave. Technology is the lens used to track device shipments and sales for individual vendors across the globe and to country level.

Smartphone Strategies

TechInsights’ Wireless Smartphone Strategies (WSS) subscription provides comprehensive coverage of the smartphone industry. WSS is a global handset and smartphone tracker by volume, value with price-tier and value share / profitability as key differentiators. Granular OEM forecasts for the next 4 quarter and country-level smartphone forecast data for the next 5 years are provided.

Wearable Device Ecosystem

TechInsights’ Wearable Device Ecosystem (WDE) subscription gives you timely, super-detailed tracking of wearable device shipments and market share on a global, regional, and country basis for top-selling vendors such as Apple Watch or Xiaomi Mi Buds. WDE service delivers a deep dive into the high-growth wearables market. WDE tracks and forecasts wearables markets by size, market share and price.

Mobile Handsets

Our mobile handsets channel includes teardowns of smartphones and tablets. Our device selection covers a variety of major geographical centers. Sample manufacturers include Apple, HTC, Huawei, Samsung, Xiaomi, Lenovo, LG, Sony, Nokia, Oppo, Vivo.

Notebook PCs/Tablets

Our notebook & tablets channel provides teardowns of the highest volume devices worldwide in the notebook and tablet spaces. Device selection will offer insight into multiple segments including tablets, laptops, ultra-books and 2-in-1 detachable hybrids. Sample manufacturers include Microsoft, Apple, Lenovo, Dell, Hewlett Packard, Xiaomi.

Wearables

Our wearables channel covers personal health and fitness wearable systems, smartwatches, virtual reality (VR) headsets, hearables, and action cameras. Sample manufacturers include: FitBit, Garmin, Samsung, LG, Apple, Huawei, Sony, Xiaomi.

Tablet

• Shipments, Revenue, Installed Base, Penetration by FormFactor by 88 Countries
• Cellular Connectivity and eSIM by FormFactor
• Operationg System and Price Tier by 88 Countries by FormFactor
• Display Size by FormFactor
• Channel and Customer Type

Notebook PC

• Shipments, Revenue, Installed Base, Penetration by FormFactor by 88 Countries
• Cellular Connectivity and eSIM
• Operationg System
• Display Size

Both (Tablet and Notebook PC)

• Enabling Technologies (Wi-Fi, Biometric Security, Ports, Processors, Aspect Ratios, etc.)
• Mobile Computing Penetrations (Tablets, Notebooks) by 88 countries

Tablet

• Shipments and Revenue by Vendor and OS by Region
• North America Shipments and Revenue by Vendor and OS by Country

Notebook PC

• Shipments and Revenue by Vendor and OS by Region
• North America Shipments and Revenue by Vendor and OS by Country

TechInsights’ Connected Home Devices subscription gives you instant access to our extensive supply-side research and analysis of the latest trends impacting the global consumer electronics market. Served through the TechInsights Platform, you can view our current and historical forecasts and market trackers, read our expert commentary, and understand the competitive landscape across a range of product categories including Flat Panel TVs, Game Consoles, Wireless Speakers, Soundbars, Set-top Boxes, Streaming Media Players and Ebook readers.

Smart Home

Teardowns will provide analyses on an assortment of products ranging from operator deployed Set-Top-Boxes and OEM media streaming devices to smart speakers, wifi routers, and surveillance cameras. Get insights on costing trends and design techniques across the smart home ecosystem. Sample manufacturers include Amazon, Google, Roku, Apple, Samsung, Sony.

Chip Market Research

Chip Market Research Services is a modular strategic planning, marketing, and communication tool that spans the semiconductor manufacturing industry.

• The Forecast Pro provides the real-time data a professional analyst needs to predict how trends in the semiconductor business environment will affect their business and investments.
• IC Equipment Databases cover market shares with annual and quarterly forecasts for these segments.

Semiconductor Analytics

Semiconductor Analytics is a weekly report addressing the semiconductor supply chain. The research and analysis is end-demand focused and has the objective of providing up-to-date business knowledge. Week-by-week data on electronics and semiconductor demand, along with monthly key performance indicators in electronics and semiconductor application markets are provided to semiconductor suppliers.

Critical Subsystems

Critical Subsystems covers the market on subsystems for semiconductor and related production equipment. These subsystems have been developed to address specific applications and processes within these industries and are dedicated for use on a single tool or process chamber. They perform a particular function in the following key technology areas: Fluid Management, Integrated Process Diagnostics, Optical, Process Power, Thermal Management, Vacuum, and Wafer Handling.

Test Connectivity Systems

Annual analytics reports that cover test connectivity markets, suppliers, and key customer trends. They include Probe Card, Test & Burn-in Socket, and Device Interface Board (DIB) market analyses.

Microprocessor Report

This industry-leading weekly journal covers new Microprocessors and SoCs, providing insight into their target application and market, and differentiation from their competitive products. This will expand your access to more of the information you need to compete globally and enhance your ability to make fact-based decisions that will impact your business faster and more effectively.

The McClean Report

Identify how to better position your business to be competitive. You don’t have to be an expert in semiconductors to understand the broad variety of analyses and perspectives, and how the McClean Report and other subscriptions can complement your business, and your business decision-making – Not only from the technical or legal point of view but also from the geopolitical, and regional market(s) angle.

January Semiconductor Industry Flash Report:

• Provides IC Insights’ initial overview and annual forecast of the semiconductor industry for the upcoming year and through 2026.

August IC End-Use Database:

• With electronic system type arranged data (computer, communications, consumer, automotive, industrial, Government/military), by device type (microcontrollers, memory, analog, etc.) and by region (Europe, Americas, Asia-Pacific).

1st Quarter February 2023:

• Expanded capital spending analysis of major IC categories, forecast by product type, and more.

2nd Quarter February 2023:

• Company sales ranking by major IC product categories, R&D spending forecast and analysis, deeper examination of China’s semiconductor market and more.

3rd Quarter February 2023:

• IC end-user database, IC foundry forecast update, M&A scoreboard and trends, firsthalf supplier sales ranking, and more.

4th Quarter February 2023:

• Year-end review and IC and O-S-D markets forecast. 2022 recap of major IC product categories, top supplier ranking, expanding capital spending analysis, leading.

The Chip Insider®

The Chip Insider® provides insider knowledge of the to semiconductor industry highlighting issues between suppliers and customers; companies’ strategies; industry trends, challenges, projections, and historic facts; and opinions to C-Suite executives from TechInsights’ insider G. Dan Hutcheson, in an open, straightforward, and informative way.