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Synaptics VS680 AI SoC Digital Floorplan Analysis
The Synaptics VideoSmart VS680 AI SoC found in Banana Pi BPI-M6 single board computer, using TSMC 12nm CMOS FinFET (likely 12FFC) process.
Quectel RG255C-GL 5G Red-Cap Deep Dive Teardown
Quectel announced RG255C-GL module with 5G reduced capacity sub-6GHz on April 9, 2024 designed for global market. It is embedded with Qualcomm Snapdragon SDX35 Baseband Processor and JSFCBA3YH3BBG-425 RAM/NAND memory from Jeju Semiconductor.
Tracker: VALUE SHARE: Global Smartwatch Revenue and ASP by OS by Price Tier: 2024 Q1
Global smartwatch revenues fell by 4% YoY during Q1 2024. The decline was driven by slumping shipment volumes and declining ASPs due to macroeconomic weakness and geopolitical uncertainty limiting consumer demand and discretionary spending and causing a lengthening replacement cycle.
Unknown 122B050-A1 SAW Filter (90SSPNWAM) Acoustic Wave Filter Report
This process analysis report examines the TF-SAW filter die, marked 122B050-A1, located in the 90SSPNWAM mid-high band power amplifier with an integrated low noise amplifier and duplexer (MHB L-PAMiD) within the Huawei Nova 12 Pro (ADA-AL00) 5G smartphone.
Apple A17 Pro SoC CPU Design Analysis
This report provides an analysis of the standard cells comprising about 70% of the area analyzed in the logic block of the Apple A17 Pro SoC CPU. Standard cells schematics are extracted to determine routing efficiency, gate density and global metal usage survey.
HiSilicon Hi1105-GFCV100 Wi-Fi SparkLink SoC Advanced CMOS Process Analysis
The HiSilicon Hi1105GFCV100 WiFi/BT/GNSS SoC was fabricated using HLMC’s 28nm HKMG planar RF CMOS process. The report includes a summary of key findings, and a detailed look at the FEOL, MOL and BEOL structures and materials used. Extensive SEM, TEM and materials analysis provide a complete look at how this device was manufactured.
AMD Z1 Extreme APU Digital Floorplan Analysis
This blog compares Samsung’s S6565 and S6566 Wi-Fi 6/BT 5.3/FM SoCs based on the published floorplan and RF architecture analyses. Special attention is given to the die area consumption by the RF sections. Some conclusions are offered based on specific layout changes.
Tracker: VALUE SHARE: Global Smartwatch Revenue and ASP by Vendor by Price Tier: 2024 Q1
Global smartwatch revenues shrunk by 1.5% in Q1 2024 due to declining shipment volumes as well as shrinking ASPs caused by macroeconomic weakness and geopolitical uncertainty limiting consumer demand and discretionary spending.
Market Model: Automotive Tier 1 Company Quarterly Financials
TechInsights has compiled quarterly financial data for a sampling of Tier 1s important to the automotive industry. All companies selected are public (private companies were not included). Total company revenues (including possibly non-automotive sales if applicable) are listed along with Gross Margins and Operating Margins.
Report Overview: HBM and Verticality
TechInsights' report on HBM and Verticality evaluates the impact of High Bandwidth Memory on DRAM die stacking within single accelerator cards as well as how fabs and the supply chain are reacting to this trend.
High demand and poor supply forces cloud providers to make their own silicon to stay relevant
Enterprises are demanding cheaper resources and more AI technology. Cloud providers are struggling to meet these demands using third-party CPU and accelerators vendors which control the supply, cost-base and product definition. To regain control of the main attributes of cloud - scalability and innovation - cloud providers must produce their own silicon.
Smartphone Fingerprint Sensor Market Share Q1 2024: Demand Drives Revenue Growth
This highly detailed report shows the top-500 best-selling smartphone models globally in terms of their shipments, wholesale ASP, and price band in the first quarter of 2024. The models included in the report cover 90% of the total smartphone shipments in Q1 2024, including all major vendors as well as many locally significant microvendors.
Global Top-500 Smartphone Shipments, ASP, and Price Band by Model: Q1 2024
This highly detailed report shows the top-500 best-selling smartphone models globally in terms of their shipments, wholesale ASP, and price band in the first quarter of 2024. The models included in the report cover 90% of the total smartphone shipments in Q1 2024, including all major vendors as well as many locally significant microvendors.
Global Top-500 Smartphone Revenue, Value Share, ASP, and Price Band by Model: Q1 2024
This highly detailed report shows the top-500 best-selling smartphone models globally in terms of their revenue, value share, wholesale ASP, and price band in the first quarter of 2024.
Kioxia TH58LKT3V46BA8S 162L 1Tb TLC 3D NAND Internal Waveform Analysis
The KIOXIA 162L 1 Tb TLC 3D NAND flash memory device (die markings: FXZ0_1T) was found on the DapuStor Haishen5 H5100 DPHV5108T0 SSD. Eight Toshiba TH58LKT3V46BA8S NAND flash memory packages, SSD controller, five DRAM chips, PMIC, and serial flash are identified on the SSD board.
Volkswagen’s Rivian Investment Could Signal Big Changes for CARIAD
The issues surrounding Volkswagen’s CARIAD software division have been well-documented, and by some reports, led to the ouster of former Volkswagen Group CEO Herbert Diess. The Volkswagen Group’s USD $5 billion investment in EV startup Rivian for its software expertise could signal big changes ahead for its CARIAD division.
NAFTA xEV Market Demand Outlook 2022-2031
This report summarizes forecasts for the NAFTA market for xEV systems, semiconductors, and sensors. Despite the uncertainties and challenges posed by Ukraine conflict, semiconductor shortages, and a slowing domestic and global economy, the push towards electrification and battery electric vehicles is not slowing down with volume demand continuing to grow.
2024 ADAS ECU Market Share Estimates
This Excel file contains ECU market share estimates for key ADAS technologies - a market expected by TechInsights to be worth over $20 billion in 2024. A combined, user-definable total market share is also calculated.
HiSilicon Kirin 9010 Digital Floorplan Quick Look Analysis
This report provides a quick look analysis of the floorplan design used in the HiSilicon Kirin 9010 found in the Huawei P70 Art smartphone and includes an executive summary and supporting optical and SEM cross sectional image sets.
GlobalFoundries Acquires Tagore’s GaN IP
On July 1, 2024, GlobalFoundries (GF) announced the acquisition of Tagore Technology's intellectual property (IP) in Power Gallium Nitride (GaN). This high-power density GaN solution was developed by Tagore to improve efficiency and performance in power applications across the automotive, IoT, and AI datacenter sectors.
Chinese xEV Market Demand Outlook 2022-2031
This report summarizes forecasts for the Chinese market for xEV systems, semiconductors, and sensors. Despite the uncertainties and challenges posed by Ukraine conflict, semiconductor shortages, and a slowing domestic and global economy, the push towards electrification and battery electric vehicles is not slowing down with volume demand continuing to grow.
Streaming Usage Overtakes FM Radio in US Market in 2024 Infotainment Survey
Between February 2024 and April 2024, TechInsights surveyed 1,510 vehicle owners in the United States about several aspects of their ownership experience, including the types of in-vehicle audio sources those owners use.
Insight: Cellular Tablet Forecast Q2 2024 – Majority of Cellular Tablets to Have eSIM in 2024
Wi-Fi does not always provide the ideal connectivity solution for mobile computing on the go. Patchy coverage and public Wi-Fi risks regarding security and sharing personal details are key factors why consumers and commercial accounts find advantages in cellular service.
Global Differences in Assisted Driving Interest and Adoption
TechInsights undertook a survey of 4,630 car owners in the US (1,510), China (1,510), the UK (401), France (402), Italy (402), and Germany (405), covering their likelihood to have bought a car with full-self driving technology, use other transport options with self-driving capabilities, or recommend certain self-driving features to others.
Forecast: Global Wearables Shipments by Type by Vendor by Quarter: 2017 to 2024
Global wearable shipments are forecasted to grow by 5.6% in 2024, after declining by 4.9% in 2023 and before that declining by 6.3% in 2022. Apple, Huawei, and Samsung will remain the market leaders in the global total wearables market.
Research Bulletin – Americas’ Chip Suppliers Continue to Dominate R&D Spending
Semiconductor suppliers located in the Americas region continuer to dominate R&D spending, but Asia-Pacific semiconductor companies increased their share of R&D expenditures to 25% in 2023.
Insight: Global Game Console Forecast – A 2024 lull in demand before new product launches drive growth in 2025
Millions of consumers tried new entertainment sources for the first time during the lockdowns and many turned to game consoles to alleviate boredom and help keep household members entertained.
FinFET Transistor Evolution
FinFET transistors have replaced planar channel transistors, beginning with Intel’s 22nm process node, and the 16nm process nodes from the major foundries. This article discusses the basics of FinFET transistors, and why this transition was necessary, as well as showing how FinFET physical dimensions impact DC performance.
Rimac Previews Verne Ride-Sharing Service
The Verne ride-sharing service was launched on June 26, 2024. The announcement is of a complete service, not just of a concept that will see further development. Verne, previously known as P3 Mobility, will come with a fleet of stylish two-seat battery electric vehicles conveying customers with a fully autonomous (SAE Level 4) driving system developed with Mobileye.
REDMAGIC Cyberbuds DAO TWS (BH4010) Deep Dive Teardown
REDMAGIC Cyberbuds DAO TWS is a flagship gaming audio buds, designed with Qualcomm S3 Gen2 sound platform, Qualcomm Bluetooth 5.3/Audio SoC, AI active noise reduction, 350 mAh Battery which leads to 7.5 hours of battery life.
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