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Huawei Mate 80 Pro Max Teardown Confirms Kirin 9030 Pro on SMIC N+3
TechInsights’ teardown of the Huawei Mate 80 Pro Max confirms the Kirin 9030 Pro on SMIC’s N+3 process and reveals major upgrades in display, cameras, and connectivity.
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Discover the five expectations defining advanced packaging in 2026, including CPO adoption, HBM4 demand, panel and glass scaling, 3D thermal challenges, and chiplets for mobile.
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Trump’s approval of H200 exports to China could reshape GPU, packaging, and HBM markets. TechInsights analyzes supply constraints, pricing, and $40–50B demand.
The Authoritative Information Platform to the Semiconductor Industry.
