Chip Observer
Tracking the market for semiconductors, from the fab floor to the customer’s door.
Latest Blogs and Commentary
Apple M1 Ultra Advanced Packaging
Packaging has become more sophisticated and a differentiator in the overall performance of advanced SoC chipsets. It can significantly impact form factor, helping to miniaturize designs in the multichip package and improve chip-chip RC delay. The Ultra is the first example of a device utilizing InFO-L technology that TechInsights has documented.
Exploring Beyond Datasheets: Assessing and Evaluating the Performance of SiC FETs
In this eBook, TechInsights brings you our first analyses of two innovative SiC FETs whose electrical characteristics are assessed with results presented under identical condition. Using a comprehensive array of test conditions and add extra valuable information, we delve into their robustness under stress and go well beyond the datasheet.
Podcast: The State of the Semiconductor Supply Chain
This on-demand podcast brings together Bloomberg Senior Hardware Analyst Woo Jin Ho and TechInsights’ Forecasting Analyst, Taylor St. Germain for an in-depth discussion about the state of the semiconductor supply chain.
Samsung ISOCELL HP1 found in the Motorola Moto X30 Pro
TechInsights has just received the Motorola Moto X30 Pro (XT2241-1) smartphone and launched an analysis on its wide-angle rear camera, confirming the Samsung HP1.
Defending Against Infringement Claims with Patent Invalidation
It doesn’t matter how long your company has been in business or how many patents it holds. Everyone is susceptible of being targeted with a patent infringement claim. How are companies supposed to protect themselves against litigation? The answer is to invalidate the asserting patent.
SMIC 7nm is truly 7nm technology, how it compares to TSMC 7nm
Comparison confirms that SMIC reaches 7nm without access to western equipment & technologies. Our analysis also uncovered many similarities between the SMIC 7nm and the TSMC 7nm, which are available in our comparison brief.
Murata/Samsung 2nd Gen mmWave AiP discovered in the Samsung Galaxy A53
Murata/Samsung 2nd Gen mmWave AiP discovered in the Samsung Galaxy A53 John Sullivan The Google Pixel 6 Pro 5G mobile handset was released in October 2021. The front end module analysis (MAR-2111-801) revealed a Murata packaged mmWave Antenna in
FitBit Ionic Recall
Unlock the secrets to optimizing smartwatch battery design with our FREE eBook. Dive into battery degradation, Fitbit Ionic's design, and overheating root causes.
Xiaomi Poco C40 Teardown
We have identified hundreds of manufacturers throughout the years and are always looking to expand our BoM Database library. So when we heard the Xiaomi Poco C40 would have a new processor from JLQ Technology, the Poco C40 jumped to the top of our list for a Quick Turn Teardown.
Graphene or not? Investigating the Panasonic NCR 21700 powering the Tesla Model 3 and Chargeasap Power bank
Graphene or not? Investigating the Panasonic NCR 21700 powering the Tesla Model 3 and Chargeasap Power bank Dr. Ali Khazaeli Panasonic is one of the top five Li-ion battery manufacturers worldwide [1]. In partnership with Tesla, they built the
The Medtronic PillCam SB3: packaging a capsule endoscope
The Medtronic PillCam SB3: packaging a capsule endoscope John Scott-Thomas Endoscopy is a medical procedure that examines the interior of a body using a camera. Common for digestive track imaging, a conventional endoscope uses a tube that is inserted
Review and Things to Know: Flash Memory Summit 2022
The Flash Memory Summit 2022 conference including an Expo was held at Santa Clara Convention Center (US) last week (Aug. 1 – 4). Many of the industry-leading memory manufacturers and module suppliers exhibited their latest products in flash storage technology. TechInsights is a recurring and popular speaker at FMS.
First commercially available Wi-Fi 7 (802.11 be) wireless router: H3C Magic BE18000
First commercially available Wi-Fi 7 (802.11 be) wireless router: H3C Magic BE18000 Radu Trandafir Less than 2 months after the announcement of Qualcomm’s Wi-Fi 7 (IEEE 802.11 be) networking chipset, known since 2019 as Networking Pro Platform, we
SMIC’s Next Generation Process
TechInsights is first and foremost focused on supporting innovation and decision making. Because of the far-reaching interest in this latest technology, we thought we would share some of the discussions we’ve been having. Here are a few of the common questions we are seeing, and our corresponding answers.
MPR Editorial: Nanometer Nonsense
Both leading foundries allowed customers to claim they were using a 4nm process when, in fact, they were using 5nm technology. This situation renders node names meaningless. Featured in our July 22 Microprocessor Report we are making this available, in full, for a limited time.
ROHM Gen 4: A Technical Review
A collaboration between Dr. Stephen Russell (TechInsights) and Prof. Peter Gammon (PGC). ROHM released their 4th generation (Gen 4) MOSFET products this year. The new range includes MOSFETs rated to 750 V (increased from 650V) and 1200 V, with a number of the available TO247 packaged components automotive qualified up to 56A/24mΩ.
Pagination
- Previous page
- Page 38
- Next page
Huawei Mate 60 Pro Mobile RF Architecture Proves They Can Compete with Top-Tier Smartphone OEMs
*Subscribers get exclusive access to additional details and annotated images.
The authoritative information platform to the semiconductor industry.
Discover why TechInsights stands as the semiconductor industry's most trusted source for actionable, in-depth intelligence.
1891 Robertson Rd #500, Nepean, ON K2H 5B7
Copyright © 2024 TechInsights Inc. All rights reserved.