Latest Blogs and Commentary
FinFET Transistor Evolution
FinFET transistors have replaced planar channel transistors, beginning with Intel’s 22nm process node, and the 16nm process nodes from the major foundries. This article discusses the basics of FinFET transistors, and why this transition was necessary, as well as showing how FinFET physical dimensions impact DC performance.
Rimac Previews Verne Ride-Sharing Service
The Verne ride-sharing service was launched on June 26, 2024. The announcement is of a complete service, not just of a concept that will see further development. Verne, previously known as P3 Mobility, will come with a fleet of stylish two-seat battery electric vehicles conveying customers with a fully autonomous (SAE Level 4) driving system developed with Mobileye.
China: Automaker Strategy Tracker 2024 Update
This data file provides in-depth analysis of OEMs' strategies in China. It illustrates each OEM's positioning in the market, their group strategy, and describes how each company is implementing each strategy for different aspects of their operations and products, such as connected car and cockpit, ADAS and autonomous driving, new energy vehicles, each automaker's semiconductor-related strategy (if applicable), and for the R&D institutions of a given OEM.
REDMAGIC Cyberbuds DAO TWS (BH4010) Deep Dive Teardown
REDMAGIC Cyberbuds DAO TWS is a flagship gaming audio buds, designed with Qualcomm S3 Gen2 sound platform, Qualcomm Bluetooth 5.3/Audio SoC, AI active noise reduction, 350 mAh Battery which leads to 7.5 hours of battery life.
Skyworks SKY58109-51 MHB L-PAMiD Packaging Analysis
The SKY58109-51 is a highly-integrated front end module. It incorporates advanced RF packaging techniques, including Skyworks' trademarked SkyShield self-shielding system. Additional packaging strategies are leveraged to reduce the package footprint and save space in the downstream product. Those strategies include integrated inductors, top and bottom-side mounted dies, and even die stacking.
Rimac Previews Verne Ride-Sharing Service
The Verne ride-sharing service was launched on June 26, 2024. The announcement is of a complete service, not just of a concept that will see further development. Verne, previously known as P3 Mobility, will come with a fleet of stylish two-seat battery electric vehicles conveying customers with a fully autonomous (SAE Level 4) driving system developed with Mobileye.
Insight: Notebook PC Operating System Forecast 2015-2029- Windows Encourages Significant Refresh Cycle
While notebook PC shipments have declined since their height in 2021 (2023 saw a 12% decline in shipments versus 2022), we expect a larger installed base to begin a new upgrade cycle en-masse in 2024, with a new peak of notebook shipments seen in 2025 (236.5 million units).
Chiplet Market – Compute Segment
The advent of chiplets marks a fundamental change in semiconductor design and production, at a time when design costs are skyrocketing. A chiplet marketplace is expected to develop, where designers can mix match chiplets from a variety of suppliers to be produced at different foundries at the optimum process nodes.
Analysis: Wired & Wireless Device Connectivity – Cross-Protocol Collaboration
TechInsights' 2024 Wired & Wireless Connectivity report will cover forecasts for USB, Bluetooth, Wi-Fi, NFC and wireless device charging. In addition, it will explore the emergence of Ultra wideband as an increasingly popular protocol for vehicle security and access solutions, as well as alternate uses such as occupant detection.
Complimentary – Samsung Updates its Mobile Image Sensor Products for 2024
Samsung has introduced its latest set of mobile image sensor products for the key smartphone segments. These include the Samsung ISOCELL HP9, ISOCELL GNJ and ISOCELL JN5. These latest CIS products are set to become Samsung’s key CIS products that target key camera applications including, Wide, Ultrawide, Telephoto and Selfie cameras.
Insight: North American Notebook PC Results Q1 2024 – Market Bounces Back 14%
Notebook PC shipments in North America totaled 14.8 million units in the first quarter of 2024, a growth of 14% versus the same period a year ago, largely driven by early AI PC momentum.
Report Overview: Computex 2024
With positive coverage at Computex and encouraging signs of market growth, is the PC back to having a formidable presence in the connected computing space? Or will a host of challenges stand in the way of a PC renascence?
Generative AI in the Telecom Industry
Explore how Generative AI is revolutionizing the telecom industry by automating tasks, optimizing networks, and enhancing customer experiences.
Analysis: Apple’s WWDC 2024 Event Showed Next-Generation CarPlay Architecture and Customization Features
This analysis discusses Apple’s company’s approach to its next-generation solution and related considerations for automakers and suppliers. Apple’s WWDC 2024 event, while focused primarily on the integration of artificial intelligence (generative AI), what is new in its iOS 18 mobile operating system, and a range of other topics, the company did provide an overview of its next-generation CarPlay solution.
Broadcom BCM88920 StrataDNX Ramon3 Switch Floorplan Quick Look Analysis
This report presents a Digital Floorplan Analysis of the Broadcom BCM88920 die found inside the Broadcom StrataDNXTM Ramon3 Fabric Element device package. The BCM88920A0KFRBG package came to TechInsights as a standalone component.
Summary – WUQi Micro WQ7036AX BT 5.3 LE Audio SoC Floorplan Analysis
This report presents a Basic Floorplan Analysis of the WUQI Microelectronics ID2 die found inside WUQI Microelectronics WQ7036AX component. The WUQI Microelectronics WQ7036AX component was extracted from the Huawei Eyewear 2 smart glasses.
Deep Dive Teardown of the Microsoft Surface Laptop Studio 2 (2029)
Microsoft Surface Laptop Studio 2 is designed for business applications, built on Intel i7 13th Gen Applications Processor and NVIDIA graphics processor. The laptop designed with two cameras, a 14.4" 120Hz display/touchscreen system, and Kioxia 1TB SSD.
End Market Demand for Advanced Packaging
We kicked off our spotlight series with a technology perspective, underscoring the crucial role of advanced packaging and chiplets in meeting end market demands. The primary impetus for these demands stems from the datacenter processing requirements propelled by accelerated computing and artificial intelligence (AI).