Latest Blogs and Commentary
Apple A17 Pro SoC CPU Design Analysis
This report provides an analysis of the standard cells comprising about 70% of the area analyzed in the logic block of the Apple A17 Pro SoC CPU. Standard cells schematics are extracted to determine routing efficiency, gate density and global metal usage survey.
HiSilicon Hi1105-GFCV100 Wi-Fi SparkLink SoC Advanced CMOS Process Analysis
The HiSilicon Hi1105GFCV100 WiFi/BT/GNSS SoC was fabricated using HLMC’s 28nm HKMG planar RF CMOS process. The report includes a summary of key findings, and a detailed look at the FEOL, MOL and BEOL structures and materials used. Extensive SEM, TEM and materials analysis provide a complete look at how this device was manufactured.
AMD Z1 Extreme APU Digital Floorplan Analysis
This blog compares Samsung’s S6565 and S6566 Wi-Fi 6/BT 5.3/FM SoCs based on the published floorplan and RF architecture analyses. Special attention is given to the die area consumption by the RF sections. Some conclusions are offered based on specific layout changes.
Illustrations of the Design Progression from Samsung’s S6565 to their S6566 Wi- Fi 6/ BT 5.3 SoC
This blog compares Samsung’s S6565 and S6566 Wi-Fi 6/BT 5.3/FM SoCs based on the published floorplan and RF architecture analyses. Special attention is given to the die area consumption by the RF sections. Some conclusions are offered based on specific layout changes.
Tracker: VALUE SHARE: Global Smartwatch Revenue and ASP by Vendor by Price Tier: 2024 Q1
Global smartwatch revenues shrunk by 1.5% in Q1 2024 due to declining shipment volumes as well as shrinking ASPs caused by macroeconomic weakness and geopolitical uncertainty limiting consumer demand and discretionary spending.
Market Model: Automotive Tier 1 Company Quarterly Financials
TechInsights has compiled quarterly financial data for a sampling of Tier 1s important to the automotive industry. All companies selected are public (private companies were not included). Total company revenues (including possibly non-automotive sales if applicable) are listed along with Gross Margins and Operating Margins.
Report Overview: HBM and Verticality
TechInsights' report on HBM and Verticality evaluates the impact of High Bandwidth Memory on DRAM die stacking within single accelerator cards as well as how fabs and the supply chain are reacting to this trend.
Volkswagen's $5 Billion Rivian Investment
Discover how Volkswagen’s $5 billion investment in Rivian could reshape its CARIAD software division, boost Android Automotive OS adoption, and influence future EV developments.
Summary – Nordic nRF54L15 TSMC 22ULL 12 Mb eReRAM Process Analysis
The Nordic nRF54L15 Bluetooth 5.4 Systems-on-Chip (SoC), the first SoC in the nRF54L series which begins sampling in October 2023, features a 128 MHz Arm Cortex-M33 processor, 1.5 MB (equivalent of 12 Mb) of non-volatile memory (NVM) and 256 KB of RAM. The Nordic TMRC83 die is fabricated using TSMC 22 nm ultra-low leakage (22ULL) with embedded resistive random-access memory (eReRAM) process.
SEMICON WEST 2024: The Premier Microelectronics Event
TechInsights will be attending and presenting at SEMICON WEST. Join us to explore groundbreaking technologies transforming the microelectronics sector and enabling smart applications.
Qualcomm Snapdragon XR2 Gen 2 (AI Integration) Digital Floorplan Analysis
The Qualcomm Snapdragon XR2 Gen 2 SXR2230P-100-AB (HG11-355514-1) found in the Meta Quest 3 Mixed Reality VR Headset, using Samsung 4nm (4LPX) FInFET high-k metal gate (HKMG) CMOS process. The application processor features Qualcomm Kyro-CPU and Adreno GPU, and LPDDR5x memory controller interfaces to support next-generation MR and VR for all. Explore this digital floorplan analysis (DFR) to find out the process node, BEOL stack, bit cell usage, and manufacturing cost deeply.
High demand and poor supply forces cloud providers to make their own silicon to stay relevant
Enterprises are demanding cheaper resources and more AI technology. Cloud providers are struggling to meet these demands using third-party CPU and accelerators vendors which control the supply, cost-base and product definition. To regain control of the main attributes of cloud - scalability and innovation - cloud providers must produce their own silicon.
Analysis: How hyperscalers and cloud service providers benefit by building custom AI accelerator ASICs
Hyperscalers and CSPs could have purchased accelerators from Nvidia, AMD, Intel, or numerous start-ups building accelerator products. Better yet, they could have even purchased one of these start-ups. Yet they invested in their accelerator solution. What was their motivation? Why did the hyperscalers and CSPs go through the trouble of building their accelerators?
AI Memory Supply Chain Is Still Lagging Demand
Semiconductor equipment order activity held at 87 °F last week. Memory remains the hottest segment. Advanced packaging continues gaining traction as the supply for AI is still catching up to demand.
Logic IC Sales Up 15% YoY the week ending June 21, 2024
Semiconductor sales increased 5% last week and were up 27% from this time last year. TechInsights forecasts Logic IC sales will increase 16% to $324 billion in 2024.
Scaling Logic for the Future: Unveiling the Next Decade's Evolution - Module 1
In the realm of integrated circuit design, scaling plays a pivotal role in driving technological advancement. Initially spurred by Moore's Law in 1965, which highlighted the economic feasibility of cramming more components into circuits, scaling has since evolved through constant innovation.
FinFET Transistors: Tracing the Path of Evolution
FinFET transistors, or Fin Field Effect Transistors, have revolutionized advanced semiconductor manufacturing by replacing planar FET transistors, starting with Intel's 22nm technology and later adopted by other foundries at the 16nm node.
Smartphone Fingerprint Sensor Market Share Q1 2024: Demand Drives Revenue Growth
This highly detailed report shows the top-500 best-selling smartphone models globally in terms of their shipments, wholesale ASP, and price band in the first quarter of 2024. The models included in the report cover 90% of the total smartphone shipments in Q1 2024, including all major vendors as well as many locally significant microvendors.