Latest Blogs and Commentary
Huawei Mate 10 Teardown
Posted: October 26, 2017, Updated: November 15, 2017 Contributing Authors: Daniel Yang, Stacy Wegner Typically we save these kinds of full-court-press teardown events for an Apple or a Samsung Galaxy, and no doubt we are gearing up for iPhone X quick
Samsung Galaxy Note 4 & Alpha Teardown
Posted: October 17, 2014 Samsung Galaxy Note 4 , Galaxy Alpha, and Apple iPhone 6 Phones Samsung released their latest 5.7inch flagship Galaxy Note 4 ahead of schedule in South Korea, and then followed it up with the release of the Samsung Galaxy
Apple Watch Series 3 Teardown
Posted: September 13, 2017, Updated October 17, 2017 Contributing Authors: Daniel Yang, Stacy Wegner We have completed the Apple Watch Series 3 teardown. We were especially interested in its cellular functionality, and whether the LTE chipset
Apple iPhone 8 Plus Teardown
Posted: September 10, 2017, Updated: October 11, 2017 Contributing Authors: Daniel Yang, Stacy Wegner, Ray Fontaine A11 Bionic Application Processor Applications Processor The iPhone 8 Plus A1897 model we examined initially is confirmed to contain
A Guide to Multicore Processors
Covers 32- and 64-bit embedded processors with four or more CPU cores that are used for wires and wireless communications, storage, security, and other applications.
A Guide to Ethernet Switch and PHY Chips
Covers data-center switch chips for 10G, 25G, 40G, 50G, and 100G Ethernet. Also includes physical-layer (PHY) chips for 10GBase-T and 100G Ethernet.
TSMC 10 nm Process
Posted: July 26, 2017 TSMC 10 nm was found in the Apple A10X processor (APL1071) found in the Apple iPad Pro 10.5 (MQDT2CL/A). Taking a deeper look inside the TSMC 10 nm, our experts found quad-patterned FinFETs, which are first in the industry. Our
A Survey of Enabling Technologies in Successful Consumer Digital Imaging Products (Part 3: Pixel Isolation Structures)
Posted: July 24, 2017 Contributing Authors: Ray Fontaine The third topic addressed in the IISW 2017 paper was an overview of the trends we’re seeing in pixel isolation structures. These structures are critical to the performance of 1.0 µm to 1.4 µm
The 10nm Process Rollout Continues to Evolve
Explore the latest advancements in 10nm semiconductor technology, including Samsung's 10nm LPE and TSMC's 10nm FinFET processes. Learn about their impact on mobile devices like the Galaxy S8 and iPad Pro2, and discover how these innovations are driving the semiconductor industry forward.
A Survey of Enabling Technologies in Successful Consumer Digital Imaging Products (Part 2: Stacked Chip Image Sensors)
Posted: June 21, 2017 Contributing Authors: Ray Fontaine At the time of the IISW paper submission deadline in April, we hadn’t yet received the Sony Xperia XZs with 3-layer stacked Motion Eye camera. The technology development had been announced at
Samsung 18 nm DRAM cell integration: QPT and higher uniformed capacitor high-k dielectrics
Posted: June 14, 2017 Contributing Authors: Jeongdong Choe, Senior Technical Fellow Samsung has begun to mass-produce their first 10 nm-class DRAM products, and we’ve taken this opportunity to analyze and compare it to the previous generations of 25
A Survey of Enabling Technologies in Successful Consumer Digital Imaging Products (Part 1: PDAF)
Posted: June 13, 2017 Contributing Authors: Ray Fontaine This year’s IISW marked the 10th anniversary of this biennial conference and corresponded to the 10th anniversary of TechInsights’ presence at the workshop. Don Scansen attended in 2007, under
Memory/Selector Elements for Intel Optane™ XPoint Memory
Posted: June 07, 2017 Contributing Authors: Jeongdong Choe, Senior Technical Fellow Figure 1. A comparison of memory density TechInsights has continued to dig into the process, cell structure and materials analysis of the Intel OptaneTM XPoint memory
SK hynix’ 21 nm DRAM Cell Technology: Comparison of 1st and 2nd generation
Posted: June 05, 2017 Contributing Authors: Jeongdong Choe, Senior Technical Fellow Die Photo SK hynix successively developed their 2nd generation 21 nm DRAM technology last year. Low yield and reliability issues on 21 nm 1st generation, means their
A Guide to Processors for IoT and Wearables
Covers processors and connectivity chips for IoT clients and wearable devices, focusing primarily on single-chip solutions with integrated radios.
Intel 3D XPoint Memory Die Removed from Intel Optane™ PCM (Phase Change Memory)
Posted: May 18, 2017 Contributing Authors: Jeongdong Choe, Senior Technical Fellow Figure 1: Xpoint Memory Package Figure 2: Xpoint Memory Die (16 GB) TechInsights recently acquired and tore down an Intel OptaneTM M.2 80mm 16GB PCIe 3.0 and
Intel 3D XPoint
Posted: May 16, 2017 3D XPoint technology was unveiled by Intel and Micron in August 2015, creating the first new memory category in more than 25 years. When Intel announced the Optane brand for storage products based on 3D XPoint technology, it
Sony IMX400 3-Layer Stacked (Exmor RS) CMOS Image Sensor
Posted: May 11, 2017 Sony Mobile announced the Xperia XZs at Mobile World Congress in February 2017. The Xperia XZs features a 1/2.3-inch optical format, 19 Mp resolution, Exmor RS “Motion Eye” camera offering with 960 fps video and predictive