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Deep Dive Teardown of the SuperMicro GPU SuperServer SYS-741GE-TNRT GPU Server
The Supermicro server contains two Intel Xeon Sapphire Rapids processors. It has a mechanical structure typical of professional servers in this class.
Deep Dive Teardown of the Honor X50 ALI-AN00 Smartphone
The Honor X50 was supplied for the first time by Qualcomm octa-core Snapdragon 6 Gen 1 processor SM6450-500-AB with package size 12.54 × 12.04 mm while the die size was 8.05 × 6.65 mm.
Driving Towards a Sustainable Future with Electric Vehicles
The global automotive landscape is transforming as the push for sustainability grows. Governments and consumers are driving the shift to electric vehicles (EVs), with countries like the EU, U.S., and China leading the way.
Cadence Boosts DLA Speed By 20×
Cadence’s Neo AI licensable IP block provides up to 80 TOPS of performance. Its NeuroWeave SDK unifies AI design across all Cadence IP options.
Intel Core Ultra Accelerates AI
Accelerated AI is a key feature of Intel’s forthcoming Core Ultra (Meteor Lake) processors.
Hexagon Adds INT4 Support
Peak raw performance of the Hexagon-based AI accelerator in Qualcomm’s newest flagship smartphone processor is 4× greater than that of the previous generation.
Generative AI Takes Alexa and its Smart Home Ecosystem to The Next Level
Generative AI Takes Alexa and its Smart Home Ecosystem to The Next Level Share This Post On September 20, Amazon hosted its annual devices and services event that evolved at a notably slower pace, and with fewer new product announcements than in the
TechInsights' Semiconductor Analytics Report
TechInsights' Semiconductor Analytics Report
SK hynix H56G42AS8D-X014 D1y 8Gb GDDR6 HKMG DRAM Memory Floorplan Analysis
This is a Memory Floorplan Analysis (MFR) of the SK hynix GDDR6 H56G32CS die with a memory capacity of 8 Gb and a D1y generation node.
Order Activity is Cautiously Warming up
Order Activity is Cautiously Warming up Shereen Vaux Order activity for semiconductor equipment increased to 56 °F. Order activity continues heating up for subcontractors/advanced packaging to alleviate the bottlenecks still seen there. Micron’s
2023 Infotainment Report: Streaming Makes Great Gains
2023 Infotainment Report: Streaming Makes Great Gains Share This Post TechInsights surveyed 5,106 car owners in the United States (1,760), China (1,611), and Western Europe including France, Germany, Italy and the United Kingdom (1,735) covering
North America Tablet Vendor & OS, Unit & Value Market Share by Country: Q2 2023 Results
Consumers are pulling back on consumer electronics purchases this year due to budgetary constraints. In the tablet market, this has been compounded by a glut of tablet ownership during the COVID era.
Deep Dive Teardown of the QuietOn 3.1 Wireless Earbuds
The TechInsights Platform includes many reports analyzing sets of wireless headphones, including Google Pixel Buds Pro, Samsung Galaxy Buds Pro, and Apple AirPods Gen. 2.
Re-globalization and the rise of vertical supply chains
The Chip Insider®
MediaTek MT6363FW Power Management Integrated Circuit Process Analysis
This report presents a power essentials analysis (PEF) of the MediaTek MT6363FW power management integrated circuit (PMIC), extracted from the main printed circuit board (PCB) of the vivo V2241A X90 smartphone.
Qualcomm QCA6696 Wi-Fi 6/BT 5.2 SoC Floorplan Analysis (IoTB)
Qualcomm QCA6696 Wi-Fi 6/BT 5.2 SoC Floorplan Analysis (IoTB) Share This Post This report presents a Basic Floorplan Analysis (BFR) of the Qualcomm HG11-YG502-200 die found inside Qualcomm QCA6696. The QCA6696 was extracted from the Quectel AF50T, an
Global OEM Autonomous Vehicle Strategies: 2023 Update
In this update, TechInsights explores Global OEMs high end advanced driver-assistance system (ADAS) and autonomous driving (AD) strategies used to develop safer and more profitable vehicles.
Dedicated AR Headset Forecast by Price Tier 2013-2028 3Q 2023
TechInsights expects the global dedicated AR headset market to be worth over $32B (wholesale revenue) and grow to an installed base of just under 160m by 2028.