Latest Blogs and Commentary
5 Expectations for the Mobile Market in 2026
Join TechInsights on Jan 5/6, 2026, for a free webinar on the top 5 mobile semiconductor market expectations. Explore AI adoption, hardware innovation, tariffs, BRIC market growth, and form-factor shifts.
5 Expectations for the Manufacturing Market in 2026
Join TechInsights on Jan 14/15, 2026, for a free webinar exploring five key trends in semiconductor manufacturing, including AI-driven capacity, sustainability, glass substrates, and equipment growth.
Summary - Apple iPad Pro A3357 11-inch M5 Deep Dive Teardown
Discover the Apple iPad Pro 11-inch M5, featuring the Apple N1 wireless networking SoC.
Summary - Apple Airpods Pro 3 A3063 Deep Dive Teardown
Take a deep dive into the Apple Airpods Pro 3, in-ear earbuds featuring the advanced Apple H2 chip and a built-in heart monitor sensor.
Summary - Oppo Find X8 Ultra (PKJ110) Deep Dive Teardown
Oppo Find X8 Ultra elevates flagship design with Snapdragon 8 Elite giving better display, camera, and battery for ultimate performance.
Summary - Vivo X300 (2509A) Deep Dive Teardown
Take a deep dive into the Vivo X300, featuring a powerful MediaTek Dimensity 9500 chipset.
Summary - Oppo Reno 14 Pro (PKZ110) Deep Dive Teardown
Deep dive of The Oppo Reno 14 Pro, a mid-range smartphone featuring MediaTek Dimensity 8450 and a 50 MP AF front camera.
Summary - Apple iPhone 17 A3258 Deep Dive Teardown
iPhone 17 A3258 US delivers next-gen power with Apple A19's premium performance for the ultimate flagship experience.
Summary - Circular Ring 2 (CC2) Deep Dive Teardown
Circular Ring 2 blends sleek design with AI-driven health tracking—smart wellness at your fingertips.
Summary - BIWIN Mini SSD 1 TB Deep Dive Teardown
Discover the BIWIN Mini SSD, an ultra-compact PCIe 4.0 x2 NVMe device analyzed in our Deep Dive teardown with detailed construction, benchmarking, and cost insights.
Summary - Xiaomi 17 Pro Max (2509FPN0BC) Deep Dive Teardown
Xiaomi 17 Pro Max packs Snapdragon 8 Elite Gen 5 power—flagship performance redefined for the Chinese market.
Summary - NVIDIA Jetson T5000 Module (P3834) Deep Dive Teardown
Key findings from the detailed disassembly of the NVIDIA Jetson T5000 Module.
Summary - Xpeng P7 (8730001ED1) Front Lane Camera Deep Dive Teardown
Xpeng P7’s system features a tri-focal front camera for 360° perception, enabling adaptive cruise control, lane centering, and long-range detection up to 200 meters.
The Chip Insider® – IEDM 2025. Nvidia versus Google.
Explore what IEDM 2025 signals for AI and semiconductors, from Nvidia vs. Google and xPU strategy to research shaping the next decade.
Summary - Samsung The Premiere 5 Projector (SP-LPDF5S) Deep Dive Teardown
Samsung's The Premiere 5 smart projector is a 4K ultra-short-throw device that delivers up to 100-inch displays and features infrared technology. Explore detailed construction, benchmarking, and cost data in the comprehensive Deep Dive report.
Semiconductor Emissions Are Exploding: What the Forecast Says About AI, 3D NAND, and the Global Grid
Discover how AI, Logic, and 3D NAND are driving a surge in semiconductor carbon emissions—key insights from the Global Semiconductor Carbon Emissions Forecast, 2026–2030.
Summary - Logitech G Pro X Superlight 2 (910-006630) Deep Dive Teardown
Dive into the Logitech G Pro X Superlight 2, a top-tier lightweight gaming mouse featuring the Hero 25K sensor and 4KHz polling rate.
Summary - Yamaha Zeekr 001 Audio Amplifier Deep Dive Teardown
Zeekr 001’s Yamaha amp powers 12 speakers with DSP precision & EV sound—premium audio meets driving thrill.