YMTC 232L TLC 3D NAND Flash Transistor Characteristics Report
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This report presents key DC electrical characteristics for transistors located in different regions of the YMTC 232-layer EET1A die found inside a HikSemi YMC6G008Tb78DA1C0 TLC 3D NAND flash BGA package. The HikSemi YMC6G008Tb78DA1C0 package was extracted from the HikSemi HS-SSD-CC700, 2 TB solid state drive (SSD).
The HikSemi HS-SSD-CC700 was launched in the fourth quarter of 2022 and contains two HikSemi YMC6G008Tb78DA1C0 NAND flash packages and aMaxioTech MAP1602ASSD controller. The HS-SSD-CC700 comes in an M.2 2280 form factor and supports PCI-Express 4.0 ×4 interface. The HS-SSD-CC700 is rated for sequential read speeds of up to 7,450 MB/s and write speeds of up to 6,750 MB/s.
The YMC6G008Tb78DA1C0 TLC 3D NAND flash BGA package measures 18.0 mm ×12.0 mm ×0.9 mm thick, including solder balls and contains eight stacked EET1A dies in a single stack, with bond wires connecting the lower four dies on one side and the upper four dies on the other side of the printed wiring board (PWB).
The EET1A die measures 12.62 mm ×5.40 mm as measured from the die seals, or 12.68 mm ×5.48 mm for the full die. The die is produced using YMTC 232L 3D NAND with Xtackingprocess, manufactured using eleven metal layers, including three tungsten (W) metal layers , seven copper (Cu) metal layers and a top aluminum (Al) metal layer.
Transistor measurements on the YMTC EET1A die were performed in a scanning electron microscope (SEM) based environment using a Kleindiek Nanotechnik probing system and a Keithley 4200 (SCS) semiconductor characterization system. The transistors were measured at 85°C.
