YMTC 160L 512Gb TLC 3D NAND - Xtacking 4.0 Floorplan Analysis
Explore this comprehensive report analyzing the floorplan design of the YMTC 160L TLC 3D NAND – Xtacking 4.0. It includes detailed imaging sets, process node identification, and die/package cost analysis.
This report (MFR) provides an analysis of the floorplan design used in the YMTC 160L TLC 3D NAND - Xtacking 4.0 and includes an executive summary and supporting image sets optical, X-ray, SEM cross sectional, and SEM bevel imaging sets. The report provides process node and foundry identification, critical dimensions, memory and periphery functional block summaries, and die/package cost analysis
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