VLSI Technology Symposium – Intel describes i3 process, how does it
measure up?
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Intel released details of their i3 process technology. The The i3 process will offer multiple variants targeted at different applications:
- i3 base process and i3-T with TSVs targeting client, server and base die for chiplet applications,
- i3-E with native 1.2 volt I/O devices, deep N-wells, and long channel analog devices, targeting chipsets and storage applications and
- i3-PT for high performance computing and AI with 9μm pitch TSVs and hybrid bonding. This report compares the i3 to Samsung and TSMC technology, providing insight into how it measures up.
