This report presents a Power Floorplan Analysis of the Texas Instruments (TI) LMG2610 device. The LMG2610 device is a half-bridge composed of 650 V gallium nitride (GaN) high-electron-mobility transistors (HEMTs) that is highly integrated and designed to be used in active-clamp flyback (ACF) converters.
Chips, China, and Consequences: Navigating the Impact of Trump's Technology Tariffs
Explore how U.S. technology tariffs are reshaping global chip markets in Chips, China, and Consequences, an exclusive TechInsights eBook. Available only on the TechInsights Platform.
Maximize Wafer Efficiency with TechInsights’ Die Calculator
The Die Calculator from TechInsights empowers engineers, procurement specialists, and finance teams with the insights they need to understand die utilization and yield with confidence.
Earth Day 2025: A Progress Report on Sustainable Semiconductor Manufacturing
Can the chip industry scale innovation and sustainability? Discover the current state of green tech in one of the world’s most energy-intensive sectors.
