TechInsights’ NVIDIA HGX B200 Analysis Reveals HBM3E Supplier and Advanced Packaging Innovation
3 Min Read April 14, 2025
TechInsights is in the early stages of analyzing NVIDIA’s latest high performance computing AI accelerator – the NVIDIA Blackwell HGX B200. The analysts, technicians, and engineers have already identified and captured images of some of the sought-after innovations within the accelerator’s GB100 GPUs.
HBM3E Supplier is Confirmed
The GB100 features eight high bandwidth memories (HBMs) co-packaged with two reticles worth of TSMC silicon. TechInsights confirms that NVIDIA uses SK hynix’s latest extended HBM (HBM3E) in the GB100 GPU. Each of the eight HBM packages features eight memory dies stacked in a true 3D configuration – with a separate controller die under the memory stack. Read More in the TechInsights Platform
First Commercial Instance of CoWoS-L Packaging Technology
The GB100 GPU is NVIDIA’s latest generation accelerator, promising significant performance gains over the previous generations Hopper devices. The accelerators comprise two GPU dies built on a TSMC 4 nm process node. This represents a near doubling of the GPU die area versus Hopper and significantly influences the package that houses the dies. Read More in the TechInsights Platform
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