STMicroelectronics VD55H1 i-ToF Standard Floorplan Analysis

Uncover the design of STMicroelectronics’ VD55H1 i-ToF sensor with TechInsights’ analysis of its stacked BI technology and ISP die structure.

This report provides an insight into the structure of the ISP die from STMicroelectronics VD55H1, a camera module for applications in various smart devices. The VD55H1 is an ultra-compact, low-power, low-noise, indirect Time-of-Flight (i-ToF) sensor with 0.54 MP resolution, 1/4" optical format and 4.6 µm pixel pitch and is manufactured by employing the STMicroelectonics' advanced stacked, back-illuminated (BI) technology.