This report presents a digital floorplan analysis (DFR) of the floorplan design used in the Samsung Exynos 5300 5G Modem and includes an executive summary and supporting image sets SEM cross sectional and bevel imaging sets. The report provides process node and foundry identification, critical dimensions, functional and digital block summaries and gate count, memory block analysis.
Chips, China, and Consequences: Navigating the Impact of Trump's Technology Tariffs
Explore how U.S. technology tariffs are reshaping global chip markets in Chips, China, and Consequences, an exclusive TechInsights eBook. Available only on the TechInsights Platform.
Maximize Wafer Efficiency with TechInsights’ Die Calculator
The Die Calculator from TechInsights empowers engineers, procurement specialists, and finance teams with the insights they need to understand die utilization and yield with confidence.
Earth Day 2025: A Progress Report on Sustainable Semiconductor Manufacturing
Can the chip industry scale innovation and sustainability? Discover the current state of green tech in one of the world’s most energy-intensive sectors.
