Samsung D1a EUV 24Gb DDR5 Memory Floorplan Analysis
2 Min Read August 1, 2025
Memory Floorplan Analysis of Samsung K4RHE086VP die from DDR5 RDIMM card reveals 4th-gen D1a stacked DRAM process insights.
This report presents a Memory Floorplan Analysis (MFR) of the Samsung K4RHE086VP DRAM die found inside Samsung K4RHE086VP BCCP DRAM packages. The K4RHE086VP BCCP was extracted from the Samsung M321R6GA3PB2-CCPEF DDR5 RDIMM card, obtained on August 19, 2024. The Samsung K4RHE086VP die was manufactured by Samsung using its 4th-generation D1a stacked DRAM process.
