Renesas R7KA8M2AF MCU eMRAM TSMC 22 nm - 1MB Floorplan Analysis
1 Min Read Oct 31, 2025
This report analyzes the Renesas R7KA8M2AF 8 Mb embedded MRAM die design, featuring detailed summaries, imaging sets, and cost analysis for the TSMC 22 ULL process.

This Memory Floorplan Analysis Report (MFR) provides an analysis of the floorplan design used in the Renesas R7KA8M2AF 8 Mb embedded MRAM die using TSMC 22 ULL process and includes an executive summary and supporting image sets optical, X-ray, SEM cross sectional, and SEM bevel imaging sets. The report provides process node and foundry identification, critical dimensions, memory and periphery functional block summaries, and die cost analysis.
This summary outlines the analysis* found on the TechInsights' Platform.
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