Qualcomm Snapdragon AR2 Gen 1 Floorplan Quick Look Analysis

Teardown of the Snapdragon AR2 Gen 1 chip reveals TSMC 6nm N6 process and 14 metal layers in AR glasses from NTT DoCoMo.

The Qualcomm Snapdragon AR2 Gen 1 HG11-30145-1 die found inside the Qualcomm Snapdragon AR2 Gen 1 package. The package was removed from the NTT DoCoMo MiRZA augmented reality (AR) glasses. This processor contains 4-Kryo CPU, Qualcomm Hexagon NPU 3rd Gen and Qualcomm Spectra ISP. The Qualcomm HG11-30145-1 die was fabricated on 300 mm wafers by TSMC using TSMC's N6 6 nm process. The back-end of line (BEOL) features a total of 14 metal interconnection layers, including 13 levels of copper (Cu) filled layers and a top aluminium (Al) layer used as the terminal metal (TM).