Explore the Qualcomm HG11-48949-210 die inside the QCC730, an ultra-low power Wi-Fi 4 component designed for efficient IoT connectivity in this detailed analysis.
The Qualcomm HG11-48949-210 die was found inside the ultralow power (ULP) Wi-Fi 4 Qualcomm QCC730 component. The QCC730 component is positioned as representative device for low-power IoT connectivity.
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