Qualcomm HG11-48949_210 TSMC 22 nm 12 Mb ReRAM Memory Floorplan Analysis
1 Min Read July 28, 2025
Explore the Memory Floorplan Report on Qualcomm’s HG11-48949_210 TSMC 22 nm ReRAM, featuring key process details and die cost analysis.
This Memory Floorplan Analysis Report (MFR) provides an analysis of the floorplan design used in the Qualcomm HG11-48949_210 TSMC 22 nm ULL ReRAM and includes an executive summary and supporting image sets optical, X-ray, SEM cross sectional, and SEM bevel imaging sets. The report provides process node and foundry identification, critical dimensions, memory and periphery functional block summaries, and die cost analysis.
