Omnivision OX08D10 Standard
Floorplan Analysis
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This report provides an insight into the structure of the OmniVision OX08D10 CMOS image sensor ISP die for automotive applications. The analysis provides foundry identification and a summary of the salient features observed that is accompanied by a set of SEM cross-section of the ISP die. The ISP functional floorplan and cost information are also included in the report. The OmniVision OX08D10 CMOS image sensor (CIS) is an 8 MP, 1/1.73” stacked back-illuminated (BI) TheiaCel technology CIS with a pixel pitch of 2.1 μm.
