Maxscend Microelectronics Co. Ltd. MXD9122C Diversity Receive Front-End Module Packaging Analysis (RFPK)
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The Maxscend MXD9122C is a diversity front-end module removed from the Samsung Galaxy A14 5G mobile handset. It features three dies in a wire bonded land grid array (WB-LGA) package with 24 pins. The packaging technology leverages established low cost techniques. This packaging analysis (PKG) documents the physical structures of the package and the interconnects between the dies.
