JHICC CA4S8G16V 8Gb DDR4 Memory Functional Analysis
1 Min Read Oct 27, 2025
Explore the JHICC CA4S8G16V 8 Gb DDR4 die built on a 25 nm stacked DRAM process in this detailed Memory Floorplan Analysis.
A Memory Floorplan Analysis (MFR) of the Fujian Jinhua Integrated Circuit Co., Ltd. (JHICC) CA4S8G16V_die die found inside JHICC CA4S8G16V packages. The JHICC CA4S8G16V_die is a 8 Gb DDR4 die manufactured by JHICC using its 25 nm stacked DRAM process.
This summary outlines the analysis* found on the TechInsights' Platform.
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