IC Packaging Substrate Forecast and Analysis
1 Min Read Oct 27, 2025
See how HPC and AI growth is driving adoption of advanced panel-based IC substrates and the need for industry retooling.
The large package sizes demanded by innovative HPC and AI need large substrate sizes provided by panels. At the same time, many advanced packaging technologies use wafer-level and reconstituted wafer processes, both wasteful from the efficiency of space and materials perspective. These two factors are coming together in adopting advanced IC package substrates, including panels. Leading players have committed to deployment, but industry-scale retooling is needed for success.
This summary outlines the analysis* found on the TechInsights' Platform.
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