Explore the Basic Floorplan Analysis of the Hi1105-GFCV150 die extracted from the Huawei Mate 70 Pro+ smartphone.
The HiSilicon Hi1105-GFCV150 die was found inside the Wi-Fi/BT/GNSS/NearLink Combo SoC HiSilicon Hi1105-GFCV150 component, which was extracted from the Huawei Mate 70 Pro+ smartphone. The Hi1105-GFCV150 component is positioned as representative device for IoT connectivity.
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TechInsights Appoints Dan Kim as Chief Strategy Officer
TechInsights has announced the appointment of Dan Kim as its new chief strategy officer, effective April 21, 2025. In this new role, Kim will lead TechInsights’ strategy and engagement with corporate and government customers across the Americas, Europe, and Asia.
Discover why TechInsights stands as the semiconductor industry's most trusted source for actionable, in-depth intelligence.
