GalaxyCore GC5035 (Chip Scale Package) Packaging Analysis

This document analyzes the GalaxyCore GC5035 image sensor, focusing on its CSP implementation and the evolution of packaging technology since 2014.

This is a Package Analysis summary document for the GalaxyCore GC5035 image sensor and is provided as a companion deliverable for the imager and optical sensor package analysis projects. The GalaxyCore GC5035 is a back-side illuminated (BSI) CMOS image sensor (CIS) featuring a 5-megapixel RGB Bayer color filter array with a 1.12µm pixel pitch. While GalaxyCore offers this device in three packaging configurations—chip scale packaging (CSP), chip-on-board (COB), and their proprietary chip-on-module (COM) technology [1]—this report analyzes a GC5035 implemented in CSP. GalaxyCore has utilized CSP as a core packaging technology since its early production years, with TechInsights documenting implementations as far back as 2014 (DEF-1407-803). This report presents a current look at this long standing technology.