The Fujitsu MB85AS12MT 12 Mb ReRAM die extracted from the MB85AS12MTPW-EAERE1 package. This Memory Floorplan Analysis Report (MFR) provides an analysis of the floorplan design used, the process node and foundry identification on the 40 nm process found in the MB85AS12MT 12 Mb ReRAM die.
Chips, China, and Consequences: Navigating the Impact of Trump's Technology Tariffs
Explore how U.S. technology tariffs are reshaping global chip markets in Chips, China, and Consequences, an exclusive TechInsights eBook. Available only on the TechInsights Platform.
Maximize Wafer Efficiency with TechInsights’ Die Calculator
The Die Calculator from TechInsights empowers engineers, procurement specialists, and finance teams with the insights they need to understand die utilization and yield with confidence.
Earth Day 2025: A Progress Report on Sustainable Semiconductor Manufacturing
Can the chip industry scale innovation and sustainability? Discover the current state of green tech in one of the world’s most energy-intensive sectors.
