Deep Dive Teardown of the Samsung SSD 990 Pro Heatsink MZ-V9P4T0 SSD
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The external aspect of the device is crafted from aluminum, serving as the primary component of its thermal design. This housing functions as the primary heat dissipater, absorbing and dispersing heat generated from within the device. The primary heat-producing integrated circuits (ICs) are covered with TIM (thermal interface material), establishing a connection with the housing, and facilitating the transfer of heat to ensure effective heat dissipation. Numerous SSD module reports can be found in the TechInsights Platform such as the Kioxia XD6 KXD6CRJJ3T84. This product shares striking similarities in structure and thermal design with the Samsung 990 Pro with heatsink. Both employ aluminum as their primary structural material, functioning as the primary heat sink. Heat from the memory chips is effectively dispersed through thermal pads, transferring it into the housing. The shared thermal design model is a common feature in both projects. Their distinctions lie only in their specific applications, methods of connection, and the capacity of their memory.
