Deep Dive Teardown of the OnePlus Open CPH2551 Smartphone
Share This Post
Power Management (PM8550VE-001, PM8550VS-001, and PM8550-001) used in Samsung version S24 Ultra, which indicates the use of the same chipset as flagships smartphones. ICs from Skyworks, Qualcomm and Murata provide RF chips for smartphones. Of the new RF chips, the most notable is the LB Front-End Module (SKY58101-11).
OnePlus has WiFi 7 and Bluetooth 5.3, for this used Qualcomm IC (WCN7851-101). For this smartphone Oppo provided the Marisilicon X NPU processor (PN: ZK8903-00). The chip combines the functions of NPU, ISP (Image Signal Processor), and multi-layer memory architecture. Due to RAW processing, in real time, the processor allows the user to record videos in 4K quality. This IC has two Dies inside. One of them is NPU/ISP Processor (manufacturer – ZEKU), second – memory (manufacturer – Samsung). Before this, the chip appeared only in Oppo phones.
The OnePlus Open CPH2551 is the first fordable smartphone from OnePlus. It was released on October 26, 2023. The mobile runs the OxygenOS 14 (based on Android) operating system. This model (CPH2551) was made for the USA region.
The OnePlus Open features a rear camera setup composed of a 48 MP Wide-Angle camera with LYT-T808 sensor, a 64 MP Telephoto camera with OV64B sensor, and a 48 MP Ultra-Wide-Angle camera with Sony IMX581 sensor. The foldable screen is a by-now conventional 2440 x 2268, 7.82" display, however, the material of its back plate is unusual - instead of the usual steel or titanium, OnePlus decided to use carbon fiber. The hinge assembly is mainly made from steel. However, it incorporates titanium and plastic elements. As a result, the assembly weighs 16.61 grams, like the Huawei Mate X5’s 16.26 grams.
