Chiplet Summit 2025: Insights from the Future of Chip Design

Explore key insights from the 2025 Chiplet Summit. TechInsights recaps Adrienne Downey’s presentation on chiplets and advanced packaging, plus key announcements from the event.

TechInsights attended the 2025 Chiplet Summit at the Santa Clara Convention Center, where expert Adrienne Downey presented “Chiplets and Advanced Packaging Provide Denser, Faster Chips.” This report highlights key takeaways from her presentation, along with insights on major announcements and discussions from the conference.

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