Beken BK3296 22nm Bluetooth Audio SoC Process Flow Analysis
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This report provides an analysis of the process flow and integration used in the manufacture of the Beken BK3296 Bluetooth Audio SoC, built using UMC's 22 nm ULP technology. UMC’s 22 nm ULP process derives from the company’s earlier 28 nm planar CMOS technology and offers up to a 10% relative area gain and better power/performance ratio with enhanced RF capability. The spreadsheet lists the hundreds of process flow steps likely used in its manufacture.
