Apple M2 Max APL1111 SoC Processor TSMC N5P FinFET HKMG CMOS Process Digital Floorplan Analysis
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This report provides an analysis of the floorplan design used in the Apple M2 Max APL1111 SoC Processor, fabricated using TSMC N5P FinFET HKMG CMOS process. The report includes an executive summary and supporting image sets SEM cross sectional and bevel imaging sets. The report provides process node and foundry identification, critical dimensions, functional and digital block summaries and gate count, memory block analysis.
