2 Min Read July 28, 2025
This report presents a Digital Floorplan Quick Look (DFQ) of the AMD CCD Chiplet 100-000001099_die found inside the AMD AI Max+ 395 100-000001099 SoC (System-on-Chip) package.
Inside the Future of Wearables | Teardown Insights & Market Trends eBook
Discover what's powering next-gen wearables. Get teardown insights, sensor trends, and strategic analysis in our free TechInsights eBook—built for tech leaders.
Huawei Matebook Fold Uses Kirin X90 Built on SMIC’s 7nm (N+2) Node
TechInsights confirms Huawei's Matebook Fold | Ultimate Design features the Kirin X90 SoC built on SMIC’s 7nm (N+2) process—debunking rumors of a breakthrough 5nm node.
Stay informed on the latest shifts in semiconductor policy, AI, packaging, and market dynamics in the June 2025 Chip Observer, featuring insights on Qualcomm, OpenAI, Huawei, and more.
