AMD Ryzen Series Strix Halo Advanced Packaging Quick Look Analysis
1 Min Read June 24, 2025
Uncover AMD’s latest APU innovation with our APQ summary of the AI Max+ 395 “Strix Halo” — explore its 16-core chiplet design, integrated GPU, NPU, and TSMC’s advanced InFO-oS packaging.
This is an Advanced Packaging Quick Look (APQ) summary for the AMD AI Max+ 395 processor (codename "Strix Halo"). First launched in January 2025, the APU features 16 “Zen 5” CPU cores, a 40 compute unit (CU) integrated GPU, and an AMD XDNA™ 2 neural processing unit (NPU) implemented in a disaggregated chiplet design.
The AI Max+ 395 device analyzed in this report includes a 16-core CPU spread across two core complex die (CCD) chiplets mounted next to a large input/output (I/O) die chiplet housing the GPU and NPU. The chiplets are interconnected using TSMC's integrated fan-out on substrate (InFO-oS) packaging technology, which provides a redistribution layer (RDL) for short, small pitch interconnects and an organic substrate for longer, relaxed pitch interconnections within the package.
