AMD Instinct MI350X Interconnect and Packaging Analysis

Explore AMD’s Instinct MI350X and its advanced packaging innovations powering next-generation AI performance.

This report provides deep insight into the advanced packaging innovations used in the manufacturing of AMD's Instinct MI350X. The Instinct MI350X represents AMD's third entry in the MI300 product lineup, following the MI300 family and the MI325X. Unlike the MI325X, which was an HBM upgrade of the MI300X, the MI350X is an all-new design with all-new silicon. It competes directly with NVIDIA's current generation B200 Blackwell products for the most demanding and lucrative AI applications at the world's largest hyperscalers and deployers of AI hardware.