3D NAND Technology Roadmap
Key Players Forge Ahead with Next-Gen Innovations
Welcome to our latest update on the 3D NAND technology roadmap for Q1 2024! As the industry continues to evolve at a rapid pace, it's crucial to stay informed about the advancements made by key players in the field. Let's dive into the latest updates from industry giants such as Samsung, KIOXIA/WD, Micron, SK hynix/Solidigm, YMTC, and MXIC.
Samsung has been at the forefront of innovation in the 3D NAND space. They have transitioned to a double-deck structure for V7 and introduced the COP integration for improved performance. With the release of V8 236L 1 Tb TLC products, Samsung showcases its commitment to pushing the boundaries of technology. Looking ahead, Samsung is already planning for V9 with a 280L COP V-NAND and hybrid bonding technology similar to other leading competitors.
Keeping the BiCS structure, KIOXIA and WDC have focused on improving layer counts. With the announcement of the BiCS eighth generation featuring 218 layers and plans for a subsequent version with 284 layers, KIOXIA demonstrates its dedication to advancing NAND technology.
Micron's shift to CTF CuA integration has allowed them to lead the market with the release of 176L and 232L products. They are also developing Gen7, potentially skipping the 300-layer node and aiming for a 400-layer device, showcasing their ambition for future innovation.
SK hynix continues to utilize the 4D PUC structure, with plans for the mass production of 238L V8 4D PUC products. With the announcement of 321-layer V9 samples, SK hynix is positioning itself for further advancements, possibly reaching 370- or 380-layer devices in the near future.
YMTC's Xtacking structure has seen significant progress, skipping from 176L to 232L. Despite facing challenges due to chip bans, YMTC remains focused on the development of more advanced QLC devices and multi-Xtacking technology.
MXIC has entered the market with its first-generation 3D NAND chip, catering to products like the Nintendo Switch. With plans for a second generation featuring 96L, MXIC is poised to make further strides in the industry.
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Looking ahead, the future of 3D NAND technology looks promising, with the possibility of seeing products surpassing 500 layers within the next two to three years. Advanced hybrid bonding technology will play a crucial role in achieving even higher layer counts, potentially reaching 600- or 700-layer package solutions within five years.
As the industry continues to innovate, we're excited to witness the next wave of advancements that will shape the future of NAND technology.
