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Latest Blogs and Commentary
Teardown of the Vivo X Fold3 Pro Foldable Smartphone
Join TechInsights as we teardown the Vivo X Fold3 Pro, featuring the Qualcomm Snapdragon 8 Gen 3 processor, 16 GB of RAM, and a cutting-edge camera system. Discover detailed insights into its design, battery technology, and unique features.
Rapid Increase in Microsoft’s Emissions Threatens Future Supply Deals
Multi-billion-dollar AI investments from Microsoft are seemingly coming on a weekly basis, suggesting reducing semiconductor carbon footprint is not only an ethical concern, but also big business.
6.18 Online Festival in China: Smartphone Sales Down 2% Annually
The 2024 6.18 Online Festival in China revealed a nuanced picture of smartphone sales. Despite a 2% decline in unit sales, stable market value was maintained thanks to higher average selling prices amid a broader 3% drop in overall online sales.
Teardown Unboxing: Exploring the Vivo X Fold3 Pro
Explore the innovative design and advanced features of the Vivo X Fold3 Pro, the thinnest foldable smartphone on the market. Learn about its durable carbon fiber hinge, Vivo Armor architecture, and premium aesthetics in our detailed Teardown and analysis.
Apple Vision Pro: Exploring the Design and Sustainability of Its Innovative Battery Pack
In 2024, Apple launched its groundbreaking AR/VR system, the Apple Vision Pro, featuring a notable departure from conventional designs with its external battery pack.
The Chip Insider® – China’s Semiconductor industry in failure phase
What’s Happening and What’s the Meaning: China’s Semiconductor industry enters failure phase… it’s not time to do a victory lap.
Ryzen AI 300 Claims Lead in PC TOPS
AMD’s Strix Point processors integrate an NPU capable of 50 TOPS with the new Zen 5 CPU capable of 16% better IPC and an upgraded GPU.
Intel FIVR gets a new inductor
Explore Intel's latest Coaxial Magnetic Integrated Inductor (Coax MIL) technology, enhancing voltage regulation in high-performance processors like Sapphire Rapids. Discover its impact on Intel's shift from on-motherboard to fully integrated voltage regulation and future developments in processor architecture.
Towering Memory: HBM and Verticality
Discover how the AI arms race is driving advancements in high bandwidth memory (HBM) technology, with AMD, NVIDIA, Google, and Meta pushing the limits of DRAM stacking. Learn about JEDEC's updates, hybrid bonding innovations, and their impact on data center performance.
Automotive Market Outlook Report
Automotive Market Outlook Report Automotive Semiconductor Forecast and Vendor Share Discover the latest Automotive Market Outlook Report, analyzing Q1 2024 trends and challenges in the automotive semiconductor landscape. Amid geopolitical tensions
Meeting the Challenge: Advanced Packaging’s Role in Delivering Value
As the electronics industry moves towards more sophisticated applications, the challenges in packaging semiconductors present new opportunities.
Navigating the Semiconductor Landscape: Trends, Investments, and Future Outlook (eBook)
Delve into market trends, regional dynamics, and future projections in the semiconductor industry. Discover insights from industry leaders and analysts on key topics like lithography advancements, the rise of Chinese manufacturers, and global investment strategies.
Introducing TSMC N3E: The Power Behind Apple's M4 SoC
In a recent teardown of the Apple iPad Pro 11-inch, TechInsights revealed details of Apple's latest silicon: the Apple M4 SoC, codenamed TMRV93, built on TSMC's advanced N3E process. This surprise release demonstrates Apple's agility in adopting cutting-edge semiconductor technologies ahead of schedule.
2xx-Layer Products from Samsung, SK hynix, Micron, and YMTC
Explore the latest advancements in 3D NAND technology with our comparison of multi-layer products from Samsung, SK hynix, Micron, and YMTC. Understand how Vertical Cell Efficiency (VCE) impacts performance and discover which manufacturers lead in this crucial metric.
The Chip Insider®– Nvidia’s Grand Strategy
In his keynote at Computex 2024 last week, Jensen Huang proclaimed to a cheering crowd, “We are in a new Industrial Revolution.” But his grand strategy is far more encompassing than the vision of the AI Revolution.
2024 Image Sensor - Image Signal Processor Video Briefing 1
In this briefing, foundries and process nodes used to fabricate the devices are identified, and floorplan and layout are discussed including the area allocated to the analog to digital converters, digital processing, and embedded SRAM.
Huawei Mate 60 Pro Mobile RF Architecture Proves They Can Compete with Top-Tier Smartphone OEMs
*Subscribers get exclusive access to additional details and annotated images.
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