Latest Blogs and Commentary
Samsung K9DYGY8J5B-CCK0 236-Layer 3D NAND Flash Advanced Memory Essentials
The Samsung K9AKGD8J0B die features Samsung’s eighth-generation (V8) 236-Layer 3D NAND flash memory. The dies were extracted from the Samsung K9DYGY8J5B-CCK0 NAND flash packages, contained within the Samsung MZ-V9P4T0 990 PRO 4 TB SSD, released in September, 2023.
The Chip Insider®– Future Proofing Tools: the story of the 93K
The V93000 was futureproofed from the start by visionary engineers who saw what needed to be done. Here’s the story of how they did it.
Global Smartphone Replacement Rate: North America No longer Leading
Global Smartphone Replacement Rate: North America No longer Leading Discover the global shift in smartphone replacement rates as North America loses its lead. Central & Latin America (CALA) will take the top spot in 2024, followed by Central &
Sustainability Will Lead Key Discussions at SEMICON WEST 2024
SEMICON WEST 2024 in San Francisco, Calif., July 9-11 promises to be a pivotal event for the semiconductor industry, especially with its strong focus on sustainability. This year's agenda is packed with sessions addressing the environmental challenges and opportunities within the sector.
2023 Volvo XC90 Audio Amplifier Deep Dive Teardown
Bower & Wilkins Audio Amplifier is a high-end audio 12-Channel Amplifier that was designed for Volvo XC90 2023. Communication between the audio amplifier and the audio elements in the car happens through one main connector. Part of the top aluminum enclosure is the radiator. The radiator spreads out heat from audio amplifiers and power management IC.
Survey Plus Teardown of the Oppo A18 CPH2591 Smartphone
The Oppo A18 CPH2591 is a low range smartphone added to the Oppo A series available for emerging Asian and South African markets, features dual SIM with MediaTek Helio G85 processor, two rear camera 8MP & 2MP, one front camera 5MP, 6.56 inch 1612 x 720 display.
Apple A17 Pro (3nm) Process Flow (Full) Analysis
This report provides a Synopsys 3D emulation analysis of the process flow and integration used in the manufacture of the Apple A17 Pro (3 nm), built in TSMC's N3 technology. The emulation includes SPX output files that can be used as input into other Synopsys models.
Samsung Exynos 2400 Digital Floorplan Analysis
This report presents a Digital Floorplan Analysis of the Samsung S5E9945 die found inside the Exynos 2400 component. The Exynos 2400 is the bottom package of SM-S926B/DS multi-chip package-on-package (PoP) assembly comprising the upper Samsung LPDDR5X memory package mounted on the Exynos 2400 application processor bottom package.
Survey Plus Teardown of the Realme C65 5G RMX3997 Smartphone
Realme C65 is a low range smartphone with 5G connectivity , large battery capacity, AI boost feature and ultra slim design in its range available for an Indian market. It comes with MediaTek Dimensity 6300 5G Application/Baseband processor and AI featured rear camera.
Tablet Apps Processor Market Share Model Q1 2024: Mobile AI to Reinvigorate Tablet Market
The global tablet applications processor (AP) market grew approximately 16 percent year-on-year growth in terms of revenue in Q1 2024 despite growing flat (0 percent) in processor shipment volume.
Baidu Kunlun II SoC Digital Floorplan Analysis
This report presents a Digital Floorplan Analysis of the 2RS9A die found inside Baidu KUNLUN-A2S1CAXGA component extracted from the Baidu Kunlun R200 artificial intelligence (AI) accelerator chip.
France Handset Vendor Marketshare by Operator: Q1 2024
This report tracks handset vendor market share at the four major French operators -- Orange, SFR, Bouygues Telecom and Free Mobile -- from Q1 2009 to Q1 2024. The report is an important tool for measuring the health of individual handset brands at the operator level.
Dive into Xiaomi CyberDog 2: How Does It See the World?
Discover the advanced sensory technology of the Xiaomi CyberDog 2. With 19 sensors, including vision and distance measuring cameras, this cyber pet offers impressive face recognition, object avoidance, and mapping capabilities.
Report Overview: Windows on Arm
TechInsights report on the Windows on Arm reflects on Microsoft’s operating system collaboration with Arm, who find themselves in a “win now” position. Arm, along with telecom giant Qualcomm, have a limited but unique opportunity to draw the overwhelming majority of Microsoft’s marketing resources for their aspirations in the Surface market.
Nordic nRF54L15 TSMC 22ULL 12 Mb eReRAM Floorplan Analysis
The Nordic TMRC83 die was found inside Nordic nRF54L15 Bluetooth 5.4 System-on-Chip (SoC). The nRF54L15 was extracted from the Fanstel EV-BM15 evaluation board with BM15M nRF54L15 Bluetooth 5.4 module.
Component Price Landscape (CPL) Biweekly Update - Electromechanical & Integrated Circuits
Electromechanical category components price changes started to increase in Q2 2024 and is expected to continue for the next 3 quarters.
Inside the Radios of Huawei’s Pura 70 Ultra Smartphone
In the piece entitled, “Huawei Pura 70 Ultra - The Mobile Radio: What Works, Works!” we reported, based on our initial analysis, that the Pura 70 Ultra proves that Huawei knows it has a good 5G Radio design that is completely “made in China”. TechInsights has completed an analysis of the Mobile RF Architecture of the Huawei Pura 70 Ultra (EBD-2404-801) and the results do indeed corroborate our initial findings.
Deep Dive Teardown of the Vivo X100 Pro V2324A Smartphone
The Vivo X series is well known for its cutting-edge features and premium components, especially in display and camera quality. These characteristics help the Vivo X smartphones deliver outstanding gaming performance and better photo quality.