Latest Blogs and Commentary
Samsung Demos In-Memory Processing
The company disclosed architecture and performance details for the processor-in-memory (PIM) version of its popular Aquabolt HBM2. The HBM-PIM, dubbed Aquabolt-XL, adds compute to a drop-in HBM2 stack.
The Industry Is Soaring but Carries a Tether of Caution
Equipment suppliers continue to see a very strong level of activity which is why they expect 2022 to be another solid year for them.
The Industry Is Soaring but Carries a Tether of Caution
Informing the media, public, and investors about semiconductor manufacturing trends and semiconductor industry outlook in wafer fab equipment, ATE, and assembly tools throughout the week with data and summaries from VLSI's latest reports and data analytic programs.
Downturn Warning Signs. Excessive CapEx Exuberance
Comments, Questions & Answers: IBM's Telum processor. DRAM Contract vs Spot Prices. Downturn Warning Signs. Excessive CapEx Exuberance.
Semiconductor Market on Track to Hit $0.6t in 2021
The positive sign that electronic prices are turning up, Wafer prices are 40% higher than a year ago, August WSTS was really strong, and Power Semiconductors.
Semiconductor Sales Closing in on a Record $600m Year
Semiconductor sales closed in on $12B, another all-time weekly record. Semiconductor Sales are closing in on a record $600M in 2021 with 24% growth.
IBM’s Telum processor. Aart deGeus on EDA-AI.
IBM is a powerhouse in AI, as it has always been a powerhouse in semiconductor research. But this is often in the shadow of west-coast technology giants who dominate west-centric conferences.
Semiconductor Industry Strategic Trends
This is the talk Dan Hutcheson gave for the Semiconductor Industry Association’s state of the U.S. semiconductor industry webinar.
YMTC 128L 3D Xtacking 2.0 TLC NAND
YMTC 128L Xtacking 2.0 for SSD! Finally, they might catch up with Samsung, SK hynix, and KIOXIA Dr. Jeongdong Choe September 23, 2021 TechInsights just found and quickly reviewed YMTC 128L TLC die removed from Asgard Memory (Powev Electronic
Apple iPhone 13 Pro Teardown
We received the iPhone 13 and iPhone 13 Pro in our labs and identification and early costing analysis are available below.
TSMC's Gift to the Industry
This week Andrea Lati, Dan Hutcheson, Jason Abt, and Risto Puhakka discuss what insiders are saying about: TSMC’s gift to the industry, 2021 forecast updates: Few notable changes, 2022 the big question of much higher growth, and the next big thing in image sensors.
Whitepaper - Software is Critical to Edge-AI Deployment
This white paper describes the importance of a flexible and robust software stack to edge-AI deployment. Processor vendors and intellectual-property licensers often tout the theoretical performance of their designs, but the neural-network compiler, run-time engine, and scheduler are just as critical to realizing that potential in production systems. The Linley Group prepared this paper, which EdgeCortix sponsored, but the opinions and analysis are those of the author.
Europe's Semiconductor Share Loss and Most Advanced Memory Maker
This week Andrea Lati, Dan Hutcheson, and Jason Abt discuss what insiders are saying about: Has Europe really lost so much share of semiconductor manufacturing, going from 44% in 1990 to 9% in 2020?, Semiconductor forecast of 26% for ICs and current market status, the DRAM disconnect of spot prices and contract prices and Memory.
Fitbit Luxe Teardown
Will the Fitbit Charge 5 Outshine the Fitbit Luxe? Stacy Wegner September 9, 2021 We don’t know, and we do not comment on whether one device is better than its previous generation. What we do, is look at and compare generations of devices. And while
Semiconductor Communications Market Share and Forecast
Provides five-year revenue forecasts for many categories of communications semiconductors, including Ethernet products, smart NICs, embedded and server processors, and FPGAs.
Disruptive Technology: TSMC 22ULL eMRAM
TSMC 22ULL eMRAM Die removed from Ambiq™ Apollo4 Another Disruptive Technology on Embedded Memory! Another disruptive product on embedded Memory (eMemory) has been arrived and quickly reviewed! TSMC has successfully developed and commercialized 22 nm
AMD's Chiplet Roadmap - the Nvidia-Arm Deal - Forecast
This week Andrea Lati, Dan Hutcheson, Jason Abt, and Risto Puhakka discuss what insiders are saying about. What is AMD doing next with chiplets? UK pumps the brakes on the Nvidia-Arm deal. What’s up at Intel and new processor segmentation? What’s driving continued growth in semiconductor equipment?
Bite-sized Webinar On-Demand: A Comparison of GaN Technology Approaches in USB-C Power Adapters
TechInsights has examined several GaN design wins in wall charger technology. This 22-minute presentation provides a quick comparison of the different GaN integration strategies that we have observed in recent USB-C adapters.