Latest Blogs and Commentary
CXMT CXDBCCCDM-MA LPDDR4X DRAM Memory Floorplan Analysis
The CXDBCCCDM-MA was extracted from the Xiaomi REDMI 12 5G smartphone. This report presents a Memory Floorplan Analysis (MFR) of the CXMT CXDBCCCDM-MA die found inside CXMT CXDBCCCDM-MA package.
Mike Howard
As Vice President of DRAM and Memory Markets at TechInsights, Mike Howard has over 15 years of experience tracking and researching the memory industry. As the resident DRAM guy, Mike enjoys the process of forecasting and explaining the ebbs and flows of a $100 billion, unheralded segment of the semiconductor market.
Alexandra Noguera
Alexandra Noguera is a Senior Logic Analyst at TechInsights where she provides analysis and technical support for competitive intelligence on reverse engineering of advanced CMOS technology nodes, leading SoC design and standard cells/layout analysis, and identifying IP blocks for SoC floorplan.
Skyworks 01413025 (PK7049_04 die) RF Power Tracker Floorplan Analysis (RFEF)
The Skyworks 01413025 is an RF Power Tracker module transceiver discovered inside the Google Pixel 8 Pro. This Basic Floorplan Analysis focused on the Antenna Module's fundamental properties. These included determining the minimum metal pitch, the minimum contacted gate pitch, the total number of metal layers, and the process generation used.
Semiconductor Sales increased 16% YoY the Week ending Jan 5, 2024
TechInsights' Semiconductor Analytics Report: Semiconductor sales jumped 19% last week and were up 16% from this time last year.
Rajesh Krishnamurthy
Rajesh Krishnamurthy is a senior analyst for TechInsights, an Ottawa, Canada-based reverse engineering company. TechInsights analyses a broad range of devices, giving Rajesh a unique overview of what technologies make into the real world of semiconductor production.
Reza Moghaddam
Reza joined TechInsights in 2021, with over a decade experience in renewable energy systems such as Li batteries, fuel cells, water electrolyzers, and supercapacitors.
Deyan Chen
Deyan Chen currently serves as a Process Analyst within the Reverse Engineering (RE) division at TechInsights. He specializes in conducting technical structural and material analyses, with a specific emphasis on power devices in the PMIC and wide bandgap (WBG) application fields.
Eugene Hsu
Dr. Eugene Hsu provides Technical Support for patent licensing and patent evaluation based on reverse engineering, as well as technical structural and material analysis semiconductor devices packages.
Stephen Russell
As Senior Technical Fellow for Sustainability at TechInsights, Stephen provides expert insight into carbon footprint across the entire technology life cycle, from raw materials through product manufacturing, use and end of life. Stephen also works on unique initiatives to characterize Scope 3 emissions in the use phase of consumer electronics products, with further reaching implications for data center and automotive applications.
John Sullivan
John Sullivan is a Senior IP Solutions Analyst with TechInsights. His more than 20 years within the organization – first with Chipworks, now TechInsights – have seen him in several different roles, from Circuit & Patent Analyst, Engineering Circuit Manager, to the IP side of the house, and into his current position.
Moore Threads Chunxiao GPU TSMC N7 FinFET HKMG CMOS Process Digital Floorplan Analysis
This is a Digital Floorplan Analysis (DFR) of the Moore Threads MT_SUD1_102 die found inside the Moore Threads Chunxiao graphics processing unit (GPU) component. The Chunxiao GPU was removed from a Moore Threads MTT S80 graphics card.
Global Smart Speaker and Smart Display Market Insights 3Q 23
This report complements and discusses the recently published Q3 2023 data reports focused on Smart Speakers and Smart Displays
Analysis: Global 5G and LTE Handset Revenue and ASP by Vendor – Q3 2023
Global 5G handset industry revenues and shipments continued to stagnate in Q3 2023. Apple remains the leader of 5G shipments and revenues, but Samsung is growing quickly behind Apple. Samsung is the world’s second-largest 5G vendor in terms of shipments and revenues.
Deep Dive Teardown of the SK Hynix PE8110 HFS960GEETX070N SSD
SK Hynix had the overall design wins for the SKHynix PE8110 960GB, supplying both RAM and NAND Flash Memory and the SSD Controller. Texas Instruments provided the temperature sensor. The SK Hynix PE8110 SSD features a PCIe 4.0 x4 with NVMe.
Radu Trandafir
Radu Trandafir is a mobile RF subject matter expert within the Technology Office at TechInsights. Radu’s background includes more than 25 years in designing, engineering, analyzing, and reverse engineering hardware and software systems.
Dan McGrath
Dan McGrath Senior Technical Fellow, Image Sensor Dan has worked for over 40 years specializing in the device physics of pixels, both CCD and CIS, and in the integration of image-sensor process enhancements in the manufacturing flow. He received his
Unlocking On-Device AI Marvels at CES 2024
CES 2024 witnessed an AI revolution with NVIDIA, Qualcomm, Intel, and AMD leading the charge.