Latest Blogs and Commentary
MWC Post Show Video 1: Insights from Mobile World Congress 2024
Join TechInsights MWC attending analysts as they reflect on some of the biggest surprises and takeaways from the event and discuss which of their pre-show predictions rang true.
Smartphone Display Panel Market Share Q4 2023: Strong Growth in OLED Panel Shipments
The global smartphone display panel market fell nearly 5% percent year-over-year in Q4 2023. The revenue declined on the back of weakening LCD market and fall in OLED panel ASPs due to intense competition in the period. Samsung Display secured top spot with over 55 percent revenue share followed by BOE Technology and LG Display.
LTE / LTE-Advanced Handset Vendor Shipments by Country: Q4 2023
LTE-Advanced handset market has continued to show a descending curve as more 5G smartphones are shipped to major countries recent quarters. 5G dynamics have substantially started to change 4G dynamics. In Q4 2023, India has become the biggest LTE-A handset market in the world for 14 quarters in a row, by volume.
DRAM Market Report Q1 2024
This quarterly report provides a comprehensive analysis of the DRAM market, covering key aspects such as supply and demand dynamics across various segments including PC, datacenter, mobile, automotive, and more. It meticulously maps the entire DRAM market landscape, offering insights into production volumes, pricing trends, technological advancements, and market shares.
Amazon's 30% Market Share: Smart Speaker Leadership in 2023
In the dynamic realm of smart technology, Amazon has maintained its pioneering position in smart speakers and displays since its inception in 2014.
Q4 2023: Lenovo-Motorola: Growth Among All Key Regions
Lenovo-Motorola’s global smartphone shipments grew 33% year-over-year (YoY) in Q4 2023 outperforming the global smartphone market driven by strong performance in its key markets US and Mexico, and strong triple digit annual growth in India.
USI 339M00227 Antenna-In-Package Packaging Analysis
This report presents a package analysis (PKG) on the USI 339M00227 mmWave AiP device. The 339M00227 AiP contains a radio frequency TX/RX transceiver die and an antenna array formed from the metallization layers of a printed wiring board (PWB).
Empowering 5G: Revolutionizing Mobile RF Design Challenges with Acoustic Wave Filters
5G requirements have driven a major shift in Mobile RF technologies and radio design. RFFE designers and engineers now need to contend with a plethora of challenges in radio design, ranging from supporting RF to tighter module integration with an increased number of components, one of which is RF filters.
Decoding the Oura Ring Gen 3: Unraveling the Mystery of Limited Mass Adoption
Our report takes a deep dive into the smart ring market, examining use cases, integration with healthcare systems, regulatory hurdles, user experience, teardown analysis, key current and future vendors, total market size and growth trajectory, as well as an in-depth look at the leading product in this space: the Oura Ring Gen 3.
Arm Adds Compute Subsystem for V3
Arm’s new Neoverse CSS N3 and CSS V3 provide a subsystem for N3 and V3 cores. For customers that won’t differentiate in that subsystem, the CSSs provide a head start.
MWC 2024: Key Takeaways for Mobile Semiconductor
The 2024 (MWC24) edition highlights the industry’s current interest areas and hot topics in a period when 5G is approaching mid-cycle deployment and growth. The topics which drew much of the attention this year in Barcelona were mobile generative artificial intelligence (AI), the emergence of 5G RedCap, and satellite NTNs.
MWC 2024: Telecoms Key Takeaways
This post-event report summarizes the top themes discussed at MWC 2024 (Mobile World Congress 2024) held from 26th Feb till 29th Feb in Barcelona. The report talks about AI the hottest topic this year at MWC across the entire telecom ecosystem and provides TechInsights' views on selected themes.
Tsingteng Micro THN31FWC1 NFC Controller Floorplan Analysis (IoTB)
This report describes a Basic Floorplan Analysis (BFR) of the Tsingteng Micro THN31FWC1 die found inside Tsingteng Micro THN31FWC1 component (a WLCSP). The THN31FWC1 was extracted from the 8849 TANK 3 smartphone.
Samsung K9YYGB8J1C-CCK0 176L QLC 3D NAND Memory Floorplan Analysis
This report presents a Memory Floorplan Analysis of the Samsung K93KGO8J0C 176L QLC 3D NAND found inside Samsung K9YYGB8J1C-CCK0. The K9YYGB8J1C-CCK0 was extracted from the Samsung T5 EVO MU-PH4T0S 4 TB Portable SSD drive.
Deep Dive Teardown of the Xiaomi 14 Pro 23116PN5BC Smartphone
The 32 MP front camera on the Xiaomi 14 Pro 23116PN5BC uses an OmniVision image sensor. Three back cameras are also included. The primary 50 MP wide-angle has an integrated OIS, an AF module, and an OmniVision image sensor. The 50 MP telephoto camera has an integrated OIS and AF module and uses a Samsung image sensor.
Intel Core Ultra 7 155H SRMZ1 Meteor Lake CPU Die Intel 4 FinFET Process Digital Floorplan Analysis
This report presents a Digital Floorplan Analysis of the CPU die (die 1) found inside Intel SRMZ1 (Meteor Lake) component extracted from the Acer 14" Swift Go 14 Multi-Touch Laptop. Meteor Lake processors, the first generation of Intel Core Ultra processors, were launched December 14, 2023. It comprises 16 CPU cores: 6 performance cores (P-cores), 8 efficient cores (E-cores), and 2 low power efficient cores (LP E-cores).
MWC 2024: Key Takeaways for Personal Computing
This report summarizes major personal computing related announcements at Mobile World Congress 2024. Companies mentioned include Qualcomm, Intel, AMD, Arm, Lenovo, Dell, Samsung and Acer. Topics covered include AI, generative AI and sustainability.
Wi-Fi 7 Comes to the Automotive Industry
With the launch of the official certification for Wi-Fi 7, semiconductor companies, for example MediaTek and Qualcomm, have already launched automotive-specific connectivity products that support this new standard. This report discusses Wi-Fi 7, provides TechInsights’ forecasts for automotive Wi-Fi feature adoption, a summary of the new standard’s features and how it compares to previous generations of Wi-Fi.